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Materials Growth Opportunities at Both Ends of the Spectrum

Hosted by the Chemical & Gases Manufacturer Group (CGMG) of SEMI

                                                                      Session Sponsor:

                                               

Tuesday, July 9, 2013
1:30pm
3:30pm
South Hall, Moscone Center

   
Description Material markets are growing as the result of opportunities for both large geometry devices and nano-scale devices.  This year’s CGMG session will focus on both ends of the device spectrum.  Materials innovation is required for larger scale devices such as printable electronics (> 0.5um line widths) as well as sub 22nm (0.022um) semiconductor devices.  Presentations will be given on material trends, related materials, as well as market statistics.  Come and find out about where materials are used and where the growth is.
     

 

Session Chair:

Lita Shon-Roy, Director, RASIRC

Session Moderator:

Tom Taylor, Director, Corporate Business Development, Dow Chemical Company

 

1:30pm-2:00pm

 

Keynote -
The More Moore and More-than-Moore Landscape - Have We Reached a Tipping Point?

(Presentation in PDF)

Dan Herr, Ph.D. (Biography)

Professor and Nanoscience Department Chair
The Joint School of Nanoscience and Nanoengineering
Greensboro, North Carolina

2:00pm-2:20pm

 

Improved Semiconductor Performance through use of Nanotechnology and Printed Electronics

(Presentation in PDF)

 

Richard Dixon (Biography)

Managing Director

Intrinsiq Materials Ltd.

 

 

2:20pm-2:40pm

Printed and Flexible Electronics Market Expectations for 2013-2020

(Presentation in PDF)

 

Christophe Fitamant (Biography)

Sales and Marketing Director

Yole Développement

 

 

2:40pm-3:00pm

Materials Innovations Driving IC Performance

(Presentation in PDF)


Paul Besser (Biography) 

Fellow

GLOBALFOUNDRIES

 

 

 

3:00pm-3:20pm


Materials Needs for Advanced Device Manufacturing

(Presentation in PDF)

 

Michael Corbett (Biography)

Managing Partner

Linx Consulting LLC

 

 

3:20pm-3:30pm

Closing Remarks

 

 


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