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SiP Applications for Advanced Fanout and 2.5D

Wednesday, July 12 2:35pm

System in Package (SiP) provides end users with great opportunity to optimize and differentiate product portfolios to meet system requirements. During his talk, ASE’s CP Hung will explore ongoing innovation in SiP technology, including Fan Out and 2.5D. He will describe how these technologies are utilized in achieving higher bandwidth connectivity, smaller form factor, increased functionality, mixed nodes, and faster time to market, all of which are extremely important for applications in the big data and mobile arenas.

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