Advanced Packaging and Interconnect
Beyne is program director of the advanced packaging and interconnect
research at imec. This team performs R&D in the field of.
high-density interconnection and packaging techniques focused on
“system-in-a-package” integration, 3D-interconnections, wafer-level
packaging, RF front-end design and technology using integrated passives
and RF-MEMS as well as research on packaging reliability including
thermal and thermo-mechanical characterization.
Eric Beyne obtained a degree in electrical engineering in 1983 and the PhD in Applied Sciences in 1990, both from the K.U.Leuven. He has been with imec since 1986. He is president of the IMAPS-Benelux committee, member of the IMAPS-Europe Liaison committee, elected member of the board of governors of the IEEE-CPMT society and IEEE-CPMT Strategic Director for Region 8