Recent Advances and Trends in Advanced Packaging

Tuesday, July 11 3:30pm

 Recent advances in fan-out wafer/panel level packaging, 3D IC packaging, 3D IC integration, 2.5D IC Integration and TSV-less interposers,  3D CIS/IC integration, and Cu-Cu hybrid bonding will be discussed in this presentation. New trends in semiconductor packaging will also be presented.

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