Dr. Grupen-Shemansky has responsibility for FlexTech’s FHE and (NBMC) R&D programs. With over 20 years of experience in the semiconductor industry, she has a strong background in research and development, manufacturing, business development, and technology strategy.
Dr. Grupen-Shemansky began her career at Motorola in semiconductor research and development. Over the course of 10 years, she held various management positions in silicon and gallium arsenide device fabrication, packaging, interconnect and system integration. Following Motorola, she was the Director of Interconnect Technology and Design Engineering in Lucent, Bell Labs, which later spun as Agere Systems. Prior to joining ANS, she was Vice President of Packaging and Interconnect Technology at Spansion, the flash memory division of AMD.
While at Bell Labs, Dr. Grupen-Shemansky launched a novel collaborative parallel design flow for silicon device and package/system design that won the attention of top tier customers and later evolved into a co-design methodology enhanced by the computer-aided design community. She has dedicated much of her career to the seamless integration of fab and post-fab semiconductor processes with advanced interconnect solutions that meet the demands of increasingly sophisticated electronic products. In addition, she has received various corporate and educational awards, has seven issued patents, numerous technical publications, and is a contributing author to Failure-Free Integrated Circuit Packages.
Dr. Grupen-Shemansky holds both bachelor’s and master’s degrees in Chemical Engineering from Pennsylvania State University and a Ph.D. in Chemical Engineering from Arizona State University.