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Enabling Advanced Technology Prototype/Pilot Design and Manufacturing
Thursday, July 14
10:30am-12:30pm
NorthTwo TechXPOT
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| Description | As innovation accelerates towards more advanced and integrated silicon based applications including 3DIC, Silicon Photonics, Advanced MEMS, New CMOS Devices and Materials, etc the need for pilot scale design and manufacturing will increase. This session will highlight the unique pilot scale design and manufacturing services available to technology startups, fabless companies, research organizations, IDMs, and universities to facilitate the rapid commercialization of new and innovative products. | |
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| 10:30am–10:50pm |  |
"Crossing the Sub-Wavelength Divide" Franklin Kalk, Ph.D. (Biography) Chief Technology Officer Toppan Photomasks Inc |
| 10:50am–11:10am |  |
“Process Feature Development Opportunities on 300mm
65nm and Beyond CMOS” Michael Liehr, Ph.D. (Biography) |
| 11:10am–11:30am |  |
"Integrated Nanophotonics in Silicon" Michael
Hochberg, Ph.D. (Biography) Assistant Professor, Photonics University of Washington |
| 11:30am–11:50am |  |
“Bridging the Chasm From Idea to Production for Emerging Technologies” Prakash Krishnan (Biography) Director of Strategic Solutions SVTC Technologies |
| 11:50am–12:10pm |  |
"3DIC Multi-Project Wafer Service – A Practical Method for Mixing Technologies on a Single Chip Footprint" Vans Tyree (Biography) Research and Development Manager Mosis |
| 12:10pm–12:30pm |  |
"Complexities and solutions for integrating die from multiple suppliers in a 3D-IC" eSilicon Corporation |
| Session Moderator: | Franklin Kalk, Chief Technology Officer, Toppan Photomasks Inc. | |
| Session presented in cooperation with Toppan Photomasks, Inc . | ||
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