Design and Manufacturing Panels

 

Tuesday, July 12

10:30am-12:45pm

NorthTwo TechXPOT


10:30am-11:35am

Design and Manufacturing Panel: Improving Yield Session

A look at what can go wrong, how to prevent problems, and how to quickly pinpoint the source of yield issues. This panel will look at improving yield from front-end design “must haves” such as ESL modeling and built-in test to back-end restrictive design rules; lithography advances such as EUV and computational scaling; pattern optimization; the effects of CMP and new substrate options; and the future effects of Moore’s Law and 2.5D/3D stacking.
     
   Moderator: Ed Sperling, Principal, SemiMD
 

    Panelists:  
    Sesh Ramaswami (Biography)
Senior Director, Strategy, Silicon Systems Group, WLP and TSV Program
Applied Materials
     
    Luigi Capodieci, Ph.D. (Biography)
Director DFM/CAD, R&D Fellow
GLOBALFOUNDRIES
     
    Kimon Michaels, Ph.D. (Biography)
Vice President, Design for Manufacturability, and Director
PDF Solutions
     
    Mike Smayling, Ph.D. (Biography)
Senior Vice President, Product Technology
Tela Innovations
     
    Mark Mason (Biography)
Director, Design Data Integration
Texas Instruments
     
     

11:40am-12:45pm

Design and Manufacturing Panel: Stacking Effects: A Look at How the Global Supply Chain will Change in 2.5D and 3D.

The promise of stacked die has enormous implications for the global semiconductor industry, from design all the way through to packaging and manufacturing. Can this work in a disaggregated industry involving IP from multiple vendors, multiple development tools, different process technologies and companies that have never had to work together in the past?

 

 

 

  Moderator: Ed Sperling, Principal, SemiMD
     
  Panelists:
 
 

Stephen Pateras, Ph.D. (Biography)
Product Marketing Director, Silicon Test

Mentor Graphics Corporation

     
    Javier DelaCruz (Biography)
Director, Manufacturing Technology
eSilicon Corporation
     
   

Charles Woychik (Biography)

Director of Marketing and Technical Analysis

Tessera Technologies Inc., Invensas Corporation Group

     
 

Colin Baldwin (Biography)

Director of Marketing and Business Development
Open Silicon

     
   

Sashi Movva

Strategic Sourcing Specialist, Staff

Qualcomm

 

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