Heterogeneous Integration with MEMS and Sensors
Tuesday, July 12
Hosted by the SEMI Advanced Packaging Committee - Americas
|Session Chair||Prof. Dr. Klaus-Dieter Lang, Head of Fraunhofer IZM|
|Description||With double-digit growth forecasted for the MEMS industry, more MEMS devices and sensors are finding applications into the global market place. Smart phones, handheld gaming devices and consoles, and automotive applications are leading the charge. With devices on the market ranging from pressure sensors, RF-MEMS, accelerometers, and gyroscopes; to microphones, microactuators, compasses, CMOS image sensors, chemical sensors, microfluidics, mirrors, and displays, there’s no doubt that MEMS are growing fast. To paraphrase the ITRS, the intersection of market and technology is calling for “More MEMS and More Than MEMS”. This session will feature speakers from all parts of the ecosystem to address how future visions will be realized through the heterogeneous integration of MEMS and ICs.|
|Welcome Remarks and Introduction Prof. Dr. Klaus-Dieter Lang, Head of Fraunhofer IZM|
Asif Chowdhury. Analog Devices
Michael Gaitan. NIST
"One Size Doesn't Fit All"
Rob O'Reilly (Biography)Senior Technical Staff
MEMS Sensors and Technology Group
Analog Devices Inc.
"MEMS and Sensor Packaging and Assembly: Challenges for Heterogeneous Integration"
Jan Vardaman - Biography
"3D Wafer Level Heterogeneous Integration"
M. Juergen Wolf (Biography)
"CMOS/MEMS Heterogeneous Integration and its
Yoshiaki Sugizaki (Biography)
Advanced BEOL Technology Department
Device Process Development Center
"Heterogeneous Integration, Confluence of Tool Boxes"
Gilles Poupon (Biography)
"Trends in Automotive Sensor Packaging"
Dr. Horst Theuss (Biography)
Sensors, MEMS and Discretes
"Developing the Mid-End Foundry"
Tomas Bauer (Biography)