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450mm Wafer Transition Forum

 

July 14 , 2011, Thursday

10:30am-12:30pm

NorthOne TechXPOT

 

    

Session Sponsor:  


Description The latest version of the industry roadmap calls for the transition to 450mm to occur in 2012. While that timeframe will likely be adjusted, there has been more concrete indication of chip-maker commitment to advancing the transition. Intel announced that its D1X facility slated to open in 2013 will be 450mm compatible and TSMC has indicated that a 450 mm pilot line could be seen by 2013 or 2014. IMEC and ISMI have well established programs focused on the challenges posed by manufacturing with 450mm wafers. With increasing customer interest in a near-term 450 pilot line development, many critical elements have to be coordinated if the vision of a ramp to affordable high volume manufacturing is to be realized. In this session, industry experts will review the R&D initiatives that may lead to fuller implementation of 450mm wafer processing and provide a status of the prevailing challenges for device makers and their suppliers.
     
Agenda    
10:30am–10:35am              Welcome remarks/Introduction

     
10:35am–10:45am  

Presentation in PDF

Paolo Gargini (Biography)

Chairman, International Technology Roadmap for Semiconductors (ITRS)
Intel Fellow, Technology and Manufacturing Group
Director, Technology Strategy

Intel

     
10:45am–10:55am

"Reaping the Benefits of the 450mm Transition"

Presentation in PDF

Thomas Sonderman (Biography)

Vice-President of Manufacturing Technology

GLOBALFOUNDRIES

 

     
10:55am–11:05am

"450mm: It's All About Economics"

Presentation in PDF

Bob Johnson (Biography)

Research Vice President

Gartner
   

 

11:05am–11:15am

 

"Role of an R&D Consortium, Imec, in a Cost Effective 450mm Migration"

Presentation in PDF

Hans Lebon (Biography)

VP Fab & Process Step R&D&M Technology

imec

     
11:15am–11:25am

 

 

"The Importance of Process Control at 450mm"

Presentation in PDF

Brian Trafas (Biography)

Chief Marketing Officer

KLA-Tencor
     
11:25am–11:35am

"The 450mm Wafer Transition: An Equipment Supplier's Perspective"

Presentation in PDF

David Hemker (Biography)

Vice President, New Product Development

Lam Research
     
11:35am-12:30pm  

Panel Discussion

Moderator: Peter Singer, Group Editorial Director, Pennwell Electronics publications
     
   
     
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