The exploding global data traffic is putting heavy demands on the network, storage, and compute centers. At the core level of the infrastructure, heat dissipation of high-performance server processor chips is a key limiter, while from application point of view there is an increasing demand to improve system performance.
In this presentation, we will reveal some of semiconductor CMOS logic and memory scaling challenges: process technologies to keep process costs under control, how design technology can help us attain the right solution. We will examine the scaling trends and review the possible paths forward for process technologies. Last but not least we will discuss how system insights, combined with technology know-how, will pave the way of the high-performance semiconductor scaling roadmap.