Subcomponent Supply Chain Challenges for 10 nm and Beyond

Wednesday, July 9, 2014
10:30am-12:30pm

 

Hosted by: SEMI Components, Instruments, and Subsystems Special Interest Group

 

 

This session will cover the challenges faced by sub-component suppliers in the supply chain to OEMs
and IDMs with the increased specifications and requirements for 10 nm and beyond. 

Attendees will hear perspectives from leading edge IDMs and OEMs as well as expectations from
critical subcomponent suppliers on how to create a more interactive and collaborative supply chain
for greater efficiency, increased technology exchanges, and cost improvements at advanced nodes.

 

 

 

 

 

Speakers                                                    


       Sponsor: 


                                                                  

 

10:30am-10:40am   

 

 

                               

 

Welcome and Introduction - Industry Landscape/Introduction of SEMI SCIS SIG

Dalia Vernikovsky

 

Presentation in PDF

 

President

Applied Seals NA, Inc.

 
10:40am-11:00am   

Importance of Sub-component Supply Chain for 10nm and Beyond 

 

Presentation in PDF

 

Device Maker Perspective -  Integrated Device Manufacturer

Sanchali Bhattacharjee

Staff Engineer

Intel Corporation

 

11:00am-11:20am   

Leveraging Supply Chain Collaboration to Meet Single Digit Nanoscale Manufacturing Challenges

 

Presentation in PDF

 

Device Maker Perspective - Foundry

Les Marshall

Manager of 450mm Standardization Programs at G450C 

GLOBALFOUNDRIES

 

11:20am-11:35am   

Precision Power Enables Device Evolution

 

Presentation in PDF

 

Component Supplier Perspective

Randy Heckman

Vice President of R&D

Advanced Energy
 
11:35am-11:50am   

Listen, Learn, Improve

 

Presentation in PDF

 

Component Supplier Perspective

Steven Chisolm 

Sr. Corporate Vice President

Pall Corporation

 



11:50am-12:05pm   

Moore’s Law & 10nm Supply Chain Challenges

 

Semiconductor Equipment Manufacturer Perspective

Dave Bowser

 

Presentation in PDF


Managing Director, Global Products Central Engineering

Lam Research Corporation 

 

 



12:05pm-12:20pm   

Defectivity Challenges for 10 nm nodes and beyond

 

Presentation in PDF

 

Semiconductor Equipment Manufacturer Perspective

Jaydeep Khedkar

Director, Corporate Strategy

KLA-Tencor 

 

 



12:20pm-12:25pm
 

SEMI Standards Update

 

Presentation in PDF


Mohamed Saleem

Vice President of Engineering & Business Development

Fujikin of America

 

   
12:25pm-12:30pm   

Closing Remarks

Adrienne Pierce  Biography

 

Presentation in PDF


Director, Business Development

Edwards

 


 

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