Variability Control – A Key Challenge and Opportunity for Driving Towards Manufacturing Excellence
Tuesday, July 8, 2014 1:30pm-3:30pm

 

Session Partner: SEMATECH
 
Variability is one of the biggest challenges when CMOS devices are scaled to meet the demand for
portable electronics with increased functionality. The problem is that device sizes have been downscaled
to the point where the electrical properties of individual devices are very sensitive to small changes in their material properties. A multi-faceted variability reduction approach is needed that comprehends integrates
chip design, process and equipment development.

 

Agenda
 
1:30pm-1:45pm

ITRS Factory Integration WG Update: Prediction and Big Data”

 

Presentation in PDF

 

James Moyne, Ph.D. (Biography)

Standards and Technology Specialist for the Applied Global Services Group at Applied Materials


 
1:45pm-2:05pm

Reducing Cost by Eliminating Variability

 

Preentation in PDF


Bill Ross (Biography)
Manufacturing Manager 

SEMATECH

 
2:05pm-2:25pm

Reduce Process Variability with Multi Sensor In-Situ Diagnostics

 

Presentation in PDF

Bill Valentine (Biography)
Chief Technology Officer

Brooks Instrument

 
2:25pm-2:45pm

Predictive Maintenance is Ready to Improve Factory Productivity

 

Presentation in PDF

 

Jimmy Iskandar (Biography)
Senior Data Scientist

Applied Materials

 
2:45pm-3:05pm

An FDC-Enhanced Arc Detection System

 

Presentation in PDF

William T. Conner, Ph.D. (Biography)

Director of Applications, Innovation Center

INFICON, Inc.

 
3:05pm-3:25pm

Cpk Based Variation Reduction in 14nm FinFET Technology

 

Presentationi in PDF

 

Rohit Pal (Biography)
Manager, Process  Integration
GLOBALFOUNDRIES

 

Session Moderator:

Bill Ross (Biography)
Manufacturing Manager 

SEMATECH

Please check back frequently for updates and more information as agendas develop and speakers are announced.

 

 

 

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