Materials Session: Speeding on the Roadmap-The Future of 3D NAND Flash

Hosted by: SEMI Chemical and Gases Manufacturers Group (CGMG) Committee


Tuesday, July 8

TechXPOT North Stage, North Hall, Moscone Center



Based on the realization that there are perhaps one or two more shrinks for planar NAND flash devices, several memory producers recently announced plans for various technology approaches to next generation 3D NAND memory devices, with samples expected in 2014.  In comparison to planar NAND, 3D NAND will offer higher endurance, faster write speed and lower power consumption, while at the same time relaxing the lithography requirements.  Instead of a lithography-driven roadmap, and the associated costs of double patterning and other critical lithography steps, memory device producers will rely on advanced etch and deposition processes, which are inherently less expensive than critical lithography processes.  In addition, the need for advanced materials, with low temperature deposition, selective etch, critical clean and planarizing capabilities will also be critical in bring these new 3D NAND technologies to market.


This two hour forum will investigate the markets for new devices; review new device structures; shed light on critical thin film technologies; discuss the implications for materials suppliers, and: allow participants to ask questions of industry leaders.




1:30pm-1:35pm                Maria Peterson photo    

Welcome and Introduction to the CGMG

Presentation in PDF

Maria Peterson (Biography)
Emerging Technologies Program Director

JSR Micro



Michael Corbett photo  

Introduction to the Session “Speeding on the Roadmap – The Future of VNAND"

Presentation in PDF

Mike Corbett (Biography)

Managing Partner

Linx Consulting



Ryan Smith photo

Overview of Market Drivers for VNAND

Ryan Smith (Biography)

Sr. Manager - SSD Product Marketing
Samsung Semiconductor



3D NAND Flash Film Deposition Challenges

Presentation in PDF

Er-Xuan Ping (Biography)

Managing Director

Applied Materials


2:20pm-2:40pm Julie Bannister photo

Etch and Clean Challenges in 3D NAND

Julie Bannister (Biography)

Etch Product Marketing Manager

Tokyo Electron America

2:40pm-3:00pm Mark Thirsk photo

Materials Market Perspective

Presentation in PDF

Mark Thirsk (Biography)

Managing Partner

Linx Consulting
3:00pm-3:30pm Q&A/Panel Discussion




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