Disruptive Compound Semiconductor Technologies
Thursday, July 10, 2014
10:30am-12:50pm
 
The unique properties of wide bandgap and compound semiconductor materials make them a promising solution for a variety of applications, from power electronics to mobile front ends, RF devices, photonic LED,  and laser components. The road ahead, however, presents plenty of issues for cost effective volume manufacturing of these devices, from lower cost substrates to high temperature packaging.  Will SiC, GaN or GaN on silicon manage the power for the next generation electric grid and hybrid/electric vehicles? Will GaAs or CMOS dominate mobile front ends?  Invited industry thought leaders will discuss the manufacturing technology challenges and opportunities in moving these high performance materials beyond limited niches to real volume markets in a silicon world.
 

Speakers

 

10:30am-10:50

Wide Band Gap Power Electronics: A Path Toward CO2 Emission Decrease

 

Presentation in PDF

 

Eric Virey (Biography)

Senior Market and Technology Analyst

Yole Développement

   
10:50am-11:10am

Commercialization of the High Voltage GaN HEMT

 

Dr. Primit Parikh (Biography)
President & Co-Founder

Transphorm

  
11:10am-11:30am Thomas Meier_Triquint    

GaAs & CMOS:  Coexistence in a Wireless World

 

Presentation in PDF

Thomas Meier (Biography)

Vice President of Custom Products Engineering

TriQuint


 
11:30am-11:50am

Department of Energy's Next Generation Power Electronics Manufacturing Institute

 

Marina Sofos

Technology Manager, Advanced Manufacturing Program
Department of Energy

 
11:50am-12:10pm

Silicon and Package Integration Enabling Power Wideband Gap Device Performance

 

Presentation in PDF


Dr. Sameer Pendharkar (Biography)

TI Fellow and High Voltage Roadmap Manager
Texas Instruments

     
12:10pm-12:30pm

Defect Inspection and Monitoring in SiC and GaN Power Device Processes

(Presentation not available)

 
Frank Burkeen
(Biography)
Vice President and General Manager, Candela Division

KLA-Tencor

 

 

12:30pm-12:40pm

ITRS PIDS Working Group Update

Paolo Gargini

Chairman
InternationalTechnology Roadmap for Semiconductor

 

 
12:40pm-12:50pm

Standards Update:Compound Semiconductor Materials Committee Activities

 

Presentation in PDF

 

Paul Trio, SEMI

 

Session Moderator:

Dr. Klaus-Dieter Lang (Biography)
Director

Fraunhofer IZM

 

Please check back frequently for updates and more information as agendas develop and speakers are announced.

 

 

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