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450mm Technology Development Update
Thursday, July 10, 2014
Moscone North, Hall E, Room 131
The transition to manufacturing semiconductor devices on larger 450mm wafer remains a potential industry inflection with significant ramifications for the entire supply chain.  Precise visibility towards investment by individual chip makers in high-volume commercial manufacturing infrastructure remains indeterminate.  However, key consortia and equipment manufacturers are proceeding with tool demonstration development. This briefing provides the latest status in industry and consortium activity and implications for future implementation, including: process equipment performance progress and challenges, wafer specification developments, lithography readiness, industry collaboration timeline status, and opportunity for green manufacturing improvements.
Please check back frequently for updates and more information as agendas develop and speakers are announced.
9:00am- 9:10am

Jonathan Davis


Welcome and Opening Remarks and Introductions

Jonathan Davis

Global Vice President, Industry Advocacy






450mm and Moore's Wall:  Connecting the Dots


G. Dan Hutcheson (Biography)

Chairman & CEO

VLSI Research



450mm Transition Status and Briefing


Paul A. Farrar, Jr.  Biography
General Manager, Global 450mm Consortium (G450C) 

CNSE Vice President for Manufacturing Innovation


G450C Technology Development Program Status


Frank Robertson  Biography

General Manager, Industry/Strategy

Global 450mm Consortium (G450C)

10:30am-10:45am Break

10:45am-11:05am Pinyen Lin

450mm Notchless Wafer Update


Pinyen Lin, Ph.D.  Biography

Director of Etch Engineering

Global 450mm Consortium






450mm Lithography


Hamid Zarringhalam  Biography

Executive Vice President

Nikon Precision

STS Networking Lunch (Room 133)

Agenda Subject to Change




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