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450mm Technology Development Update
 
Thursday, July 10, 2014
9:00am-11:30am
Moscone North, Hall E, Room 131
 
The transition to manufacturing semiconductor devices on larger 450mm wafer remains a potential industry inflection with significant ramifications for the entire supply chain.  Precise visibility towards investment by individual chip makers in high-volume commercial manufacturing infrastructure remains indeterminate.  However, key consortia and equipment manufacturers are proceeding with tool demonstration development. This briefing provides the latest status in industry and consortium activity and implications for future implementation, including: process equipment performance progress and challenges, wafer specification developments, lithography readiness, industry collaboration timeline status, and opportunity for green manufacturing improvements.
Please check back frequently for updates and more information as agendas develop and speakers are announced.
 
Agenda
 
                   
9:00am- 9:10am

Jonathan Davis

 


Welcome and Opening Remarks and Introductions

Jonathan Davis

Global Vice President, Industry Advocacy

SEMI



 
9:10am-9:40am

 

 


 

450mm and Moore's Wall:  Connecting the Dots

 

G. Dan Hutcheson (Biography)

Chairman & CEO

VLSI Research

 

9:40am-10:00am

450mm Transition Status and Briefing

 

Paul A. Farrar, Jr.  Biography
General Manager, Global 450mm Consortium (G450C) 

CNSE Vice President for Manufacturing Innovation



 
10:00am-10:30am

G450C Technology Development Program Status

 

Frank Robertson  Biography

General Manager, Industry/Strategy

Global 450mm Consortium (G450C)

 
 
10:30am-10:45am Break
 


 
10:45am-11:05am Pinyen Lin

450mm Notchless Wafer Update

 

Pinyen Lin, Ph.D.  Biography

Director of Etch Engineering

Global 450mm Consortium

 

 

 

 


 
11:05am-11:30am

450mm Lithography

 

Hamid Zarringhalam  Biography

Executive Vice President

Nikon Precision



 
12:00pm-1:30pm
STS Networking Lunch (Room 133)


Agenda Subject to Change

 

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