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Embracing what's NEXT – Devices & Systems for Big Data, Cloud and IoT


Tuesday, July 8, 2014
Moscone North, Hall E, Room 131


Hosted by: SEMI Advanced Packaging Committee

Session Chairs: Dr. William Chen, Senior Technical Advisor, ASE (U.S.), Inc. and Dr. Li Li, Distinguished Engineer, Cisco Systems


The proliferation of smart devices and smart systems deep within our society is fueling the expansive transformation of our world to a smart planet, where the Internet of Things is playing a pivotal role. Together with social media, devices today are generating big data in unprecedented volume, enabled by a broadening variety of interconnection techniques. Device and system packaging are at the forefront and evolving to surpass challenges posed by this electronics transformation.  The drive for electronics is pervasive, and at this important juncture, our industry must fully embrace change to be ready for the NEXT Big Thing.


The IC packaging community has always been swift to move ahead of the curve with new ideas and timely innovation.  As such, advanced packaging technologies hold great promise for the industry based on proven ability to enable increased bandwidth, greater speed, and lower power. Innovations in SiP, large format and wafer level packaging, embedded and heterogeneous integration and packaging with TSVs, show great potential for the progression of technologies that reside outside the box of conventional packaging architecture and beyond the realm of Moore’s Law Scaling. 


The ability of such technologies to successfully bring different devices from different foundries and different technologies and closely pack them together onto a single or multiple SiP, is opening up new vistas to IC architects, packaging engineers and system designers. Looking ahead, designs are becoming ever more application-specific and the challenge to integrate a wide variety of architectures will become even greater – from DRAM and processors to analog, RF, and passive components. How will our collaborative ecosystem further break through the traditional, the technical, and the business infrastructure boundaries and rise to meet inevitable challenges along the way? Session attendees will hear from leading industry experts and learn from their first-hand experience.






Welcome and Session Introduction

Dr. William Chen

Senior Technical Advisor

ASE (U.S.), Inc.


1:35pm-2:05pm Tao Zhang


Connected Vehicles and the Semiconductor Industry

Dr. Tao Zhang (Biography)

IEEE Fellow

Chief Scientist for Smart Connected Vehicles
isco Systems

2:05pm-2:30pm Raj Master photo

Packaging for Future Computing


Raj Master (Biography)

General Manager
IC Packaging
Quality and Reliability 




Bing Ai photo


Hwa Lee photo


Kevin Patariu photo

IP Nuances in the NEXT Landscape:

Semiconductor Patenting and Business Issues



Bing Ai (Biography)

Partner and Patent Attorney

Perkins Coie LLP





Hwa Lee, Ph.D. (Biography)


Perkins Coie LLP





Kevin Patariu, P.E. (Biography)


Perkins Coie LLP


2:55pm-3:20pm Bill Bottoms photo

Assembly and Packaging in ITRS 2.0


Bill Bottoms (Biography)

CEO and Chairman

Third Millennium Test Solutions (3MTS)


3:20pm-3:25pm BREAK

Panel - Embracing the NEXT - Devices & Systems for Big Data, Cloud and IoT

Ron Huemoeller photo

Ron Huemoeller (Biography)

Senior Vice President, Advanced Product Platform Development




Calvin Cheung (Biography)

Vice President of Engineering

ASE Group


Doug Yu photo

Embracing the Next Big Things with TSMC WLSI Technologies


Douglas Yu (Biography)

Sr. Director, Integrated Interconnect & Packaging




Closing Remarks

Dr. Li Li

Distinguished Engineer

Cisco Systems



For more information about SEMI 3DS-IC Standards Activities, click here




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