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Embracing what's NEXT – Devices & Systems for Big Data, Cloud and IoT

 

Tuesday, July 8, 2014
1:30pm-4:30pm
Moscone North, Hall E, Room 131

 

Hosted by: SEMI Advanced Packaging Committee
 

Session Chairs: Dr. William Chen, Senior Technical Advisor, ASE (U.S.), Inc. and Dr. Li Li, Distinguished Engineer, Cisco Systems

 

The proliferation of smart devices and smart systems deep within our society is fueling the expansive transformation of our world to a smart planet, where the Internet of Things is playing a pivotal role. Together with social media, devices today are generating big data in unprecedented volume, enabled by a broadening variety of interconnection techniques. Device and system packaging are at the forefront and evolving to surpass challenges posed by this electronics transformation.  The drive for electronics is pervasive, and at this important juncture, our industry must fully embrace change to be ready for the NEXT Big Thing.

 

The IC packaging community has always been swift to move ahead of the curve with new ideas and timely innovation.  As such, advanced packaging technologies hold great promise for the industry based on proven ability to enable increased bandwidth, greater speed, and lower power. Innovations in SiP, large format and wafer level packaging, embedded and heterogeneous integration and packaging with TSVs, show great potential for the progression of technologies that reside outside the box of conventional packaging architecture and beyond the realm of Moore’s Law Scaling. 

 

The ability of such technologies to successfully bring different devices from different foundries and different technologies and closely pack them together onto a single or multiple SiP, is opening up new vistas to IC architects, packaging engineers and system designers. Looking ahead, designs are becoming ever more application-specific and the challenge to integrate a wide variety of architectures will become even greater – from DRAM and processors to analog, RF, and passive components. How will our collaborative ecosystem further break through the traditional, the technical, and the business infrastructure boundaries and rise to meet inevitable challenges along the way? Session attendees will hear from leading industry experts and learn from their first-hand experience.

 

 

Agenda

 

 
1:30om-1:35pm

Welcome and Session Introduction

Dr. William Chen

Senior Technical Advisor

ASE (U.S.), Inc.

 

    
1:35pm-2:05pm Tao Zhang

Keynote:

Connected Vehicles and the Semiconductor Industry


Dr. Tao Zhang (Biography)

IEEE Fellow

Chief Scientist for Smart Connected Vehicles
C
isco Systems


   
2:05pm-2:30pm Raj Master photo

Packaging for Future Computing

 

Raj Master (Biography)

General Manager
IC Packaging
Quality and Reliability 
Microsoft

 

 

2:30pm-2:55pm

Bing Ai photo

 

Hwa Lee photo

 

Kevin Patariu photo

IP Nuances in the NEXT Landscape:

Semiconductor Patenting and Business Issues

 

 

Bing Ai (Biography)

Partner and Patent Attorney

Perkins Coie LLP

 

 

 

 

Hwa Lee, Ph.D. (Biography)

Counsel

Perkins Coie LLP

 

 

 

 

Kevin Patariu, P.E. (Biography)

 counsel

Perkins Coie LLP

 


 
2:55pm-3:20pm Bill Bottoms photo

Assembly and Packaging in ITRS 2.0

 

Bill Bottoms (Biography)

CEO and Chairman

Third Millennium Test Solutions (3MTS)

 

    
3:20pm-3:25pm BREAK
    
3:25pm-4:25pm

Panel - Embracing the NEXT - Devices & Systems for Big Data, Cloud and IoT

    
Ron Huemoeller photo

Ron Huemoeller (Biography)

Senior Vice President, Advanced Product Platform Development

Amkor

 

   

Calvin Cheung (Biography)

Vice President of Engineering

ASE Group

 

     
Doug Yu photo

Embracing the Next Big Things with TSMC WLSI Technologies

 

Douglas Yu (Biography)

Sr. Director, Integrated Interconnect & Packaging

TSMC

 

    
4:25pm-4:30pm

Closing Remarks

Dr. Li Li

Distinguished Engineer

Cisco Systems

 

 

For more information about SEMI 3DS-IC Standards Activities, click here

 

Registration

 

Register for a Day Pass and select one morning sesssion and one afternoon session offered for the day. Networking lunch is included. Save 25% and sign up for the STS package and attend one session in the morning and one session in the afternoon on Tuesday, Wednesday and Thursday.  

 

For more information about other STS Sessions, Click STS Sessions

 

You can also just register for the Test Vision 2020 Workshop.

 

 

        By June 6               Starting June 7        
Member (Day Pass)        $169         $199
Non Member (Day Pass) $199         $239
    
Member (STS Package) $380         $449
Non Member (STS Package) $449         $539


How to Register for this Program

 

Start a New Registration


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Begin a new registration record and select this and any other programs you wish to attend during step 3. If you are already registered for SEMICON West, visit www.semiconwest.org/rrc to log in to the Registration Resource Center.  Select "Agenda Builder" to add this program.
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