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Mobility and More–The M&Ms of Cost Beneficial Advanced Packaging

Tuesday, July 8, 2014
Moscone North,  Hall E, Room 131


Session Partner:



Session Chairs: Steve Bezuk, Sr. Director of Engineering, Qualcomm Inc. VP of Technology for CPMT Society of IEEE; and E. Jan Vardaman, President, TechSearch International, Inc.
The push by consumers for more access to and integration with information while on the move has created a plethora of opportunities for new devices.  No longer focused just on the mobile phone, smaller form factor and lower power devices must be made to address the needs of wearable and other mobile devices that are reaching the market today.  Packaging for these mobile devices presents a number of challenges – from materials to integration – yet all this must be done in a cost-beneficial manner.  This session will look at a number of technical solutions across the packaging value chain that need to come together to bring these devices to market on time and on budget.




9:00am-9:05am Welcome and Session Overview

Ken Gabriel photo         


Dr. Kaigham Gabriel (Biography)

Deputy Director, Advanced Technology and Projects Group

Google, Inc.



E. Jan Vardaman photo


Packaging Considerations for Wearable Electronics


E. Jan Vardaman (Biography)

Distinguished Lecturer for the CPMT Society of IEEE


TechSearch International



John Hunt photo


Pluralism in Innovation – FC Cu Pillar and FOWLP


John Hunt (Biography)

Director of Engineering, Product Promotion

ASE (U.S.), Inc. 



Panel - Fan-Out Wafer-Level Packaging (FOWLP) and its Role in Miniaturization



Ron Huemoeller photo


Ron Huemoeller (Biography)

Senior Vice President,

Advanced Products and Platform Development

Amkor Technology


Tim Olson photo


Tim Olson (Biography)

Chief Technical Officer

Deca Technologies

Antonio Barny photo

Antonio Barny (Biography)

Business Development Manager


Raj Pendse photo


Raj Pendse (Biography)

Vice President and Chief Marketing Officer


Jerry Tzou photo


Jerry Tzou (Biography)

Deputy Director, Backend Business Development






Register for a Day Pass and select one morning sesssion and one afternoon session offered for the day. Networking lunch is included. Save 25% and sign up for the STS package and attend one session in the morning and one session in the afternoon on Tuesday, Wednesday and Thursday.  


For more information about other STS Sessions, Click STS Sessions


        By June 6               Starting June 7        
Member (Day Pass)        $169         $199
Non Member (Day Pass) $199         $239
Member (STS Package) $380         $449
Non Member (STS Package) $449         $539

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