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Mobility and More–The M&Ms of Cost Beneficial Advanced Packaging

Tuesday, July 8, 2014
9:00am-12:00pm
Moscone North,  Hall E, Room 131

 

Session Partner:

CPMT

 

Session Chairs: Steve Bezuk, Sr. Director of Engineering, Qualcomm Inc. VP of Technology for CPMT Society of IEEE; and E. Jan Vardaman, President, TechSearch International, Inc.
The push by consumers for more access to and integration with information while on the move has created a plethora of opportunities for new devices.  No longer focused just on the mobile phone, smaller form factor and lower power devices must be made to address the needs of wearable and other mobile devices that are reaching the market today.  Packaging for these mobile devices presents a number of challenges – from materials to integration – yet all this must be done in a cost-beneficial manner.  This session will look at a number of technical solutions across the packaging value chain that need to come together to bring these devices to market on time and on budget.

 

Agenda

 

9:00am-9:05am Welcome and Session Overview
 
9:05am—9:50am

Ken Gabriel photo         

Keynote

Dr. Kaigham Gabriel (Biography)

Deputy Director, Advanced Technology and Projects Group

Google, Inc.

 

9:50am—10:15am

E. Jan Vardaman photo

 

Packaging Considerations for Wearable Electronics

 

E. Jan Vardaman (Biography)

Distinguished Lecturer for the CPMT Society of IEEE

President

TechSearch International

 

10:15am—10:50am         

John Hunt photo

 

Pluralism in Innovation – FC Cu Pillar and FOWLP

 

John Hunt (Biography)

Director of Engineering, Product Promotion

ASE (U.S.), Inc. 

 

10:50am—12:00pm

Panel - Fan-Out Wafer-Level Packaging (FOWLP) and its Role in Miniaturization

 

Panelists:

Ron Huemoeller photo

 

Ron Huemoeller (Biography)

Senior Vice President,

Advanced Products and Platform Development

Amkor Technology

 

Tim Olson photo

 

Tim Olson (Biography)

Chief Technical Officer

Deca Technologies


Antonio Barny photo

Antonio Barny (Biography)

Business Development Manager

NANIUM


Raj Pendse photo

 

Raj Pendse (Biography)

Vice President and Chief Marketing Officer

STATS ChipPAC


Jerry Tzou photo

 

Jerry Tzou (Biography)

Deputy Director, Backend Business Development

TSMC


 


  

Registration

 

Register for a Day Pass and select one morning sesssion and one afternoon session offered for the day. Networking lunch is included. Save 25% and sign up for the STS package and attend one session in the morning and one session in the afternoon on Tuesday, Wednesday and Thursday.  

 

For more information about other STS Sessions, Click STS Sessions

 

        By June 6               Starting June 7        
Member (Day Pass)        $169         $199
Non Member (Day Pass) $199         $239
    
Member (STS Package) $380         $449
Non Member (STS Package) $449         $539


How to Register for this Program

 

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Begin a new registration record and select this and any other programs you wish to attend during step 3. If you are already registered for SEMICON West, visit www.semiconwest.org/rrc to log in to the Registration Resource Center.  Select "Agenda Builder" to add this program.
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