Dr. Knickerbocker is an IBM Distinguished Engineer. He is the executive manager of Micro-Systems Technology & Solutions Team at IBM Research within Healthcare & Life Sciences and Science & Solutions IBM Organizations. He received his PhD degree in 1982 from the University of Illinois studying Materials Science & Engineering. He has over 33 years’ experience in IBM Microelectronics Research and Development driving new technologies into volume manufacturing products. He has authored or co-authored over 240 patents or patent applications and more than 80 technical papers and publications. He lead packaging research and development at IBM Microelectronics, East Fishkill, New York from 1983 to 2003 on ceramic & organic SCM’s & MCM’s, flip chip & board interconnections thermal solutions and board technologies, He has led packaging research at IBM T.J. Watson Research from 2003 to present on 2.5D & 3D packaging technology, electro-optical packaging and photonic integration, micro-interconnection, heterogeneous integration, wafer level and panel level integration, miniaturization technology toward micro-systems technology solutions in Healthcare Solutions, IoT and Cognitive Compuitng. He has over 10 years service in the Advanced Packaging Technology Committee at Electronic Components and Technology Conference (IEEE).