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Flexible Hybrid Electronics Forum

In the new microelectronics space, everything is up for grabs.

Presented by :   

At the Flexible Hybrid Electronics Forum, you will learn about the exciting new technology of Flexible Hybrid Electronics (FHE). Encompassing new technologies that include materials scale-up, thinned device processing, device/sensor integrated printing and packaging, system design, and reliability testing and modeling, these devices are expected to provide innovative new approaches for new products such as: wearable health monitoring for lifestyle and fitness; medical health monitoring to improve the way health care is managed; soft robotics for the elderly, disabled or injured; sensor monitoring for structures, aircraft, or automotive; and light-weight rugged sensors for harsh environments.

If you are involved in technical or business leadership, you need the latest industry information. SEMICON West provides you with strategic insights from industry thought leaders to enable you to assess the landscape, identify opportunities, and develop strategic plans. Come to SEMICON West and connect with people in your community, discover what's new, and discuss what it means for your business.

Agenda

Tuesday, July 12
Room 132, North Hall

10:30–5:00 pm

Flex Hybrid Electronics Processing and Packaging 

Confirmed Speakers:

  • Pierric Gueguen, Business Unit Manager, Yole Développement

  • Joseph Chang, Professor, Nanyang Technological University

  • Michael Ciesinski, President, FlexTech Alliance

  • Daniel Gamota, Ph.D., Vice President, Strategic Capabilities, Engineering & Technology Services, Jabil

  • Melissa Grupen-Shemansky, CTO, Flexible Electronics & Advanced Packaging, SEMI FlexTech

  • Val R. Marinov, Ph.D., CTO and Founder, Uniqarta

  • Justin McGloin, Senior Director, Engineering, Qualcomm

  • Devin MacKenzie, University of Washington

  • Bob Reuss, Consultant, Chemistry & Electronics Technology

  • Dongkai Shangguan, Ph.D.,VP & Chief Marketing Officer, STATS ChipPac

  • HManoj Chinnakonda, SIMULIA Hi-Tech Solutions Director, Dassault Systems

  • Jeff Wetzel, Ph.D., Novati Technologies

  • Hiroyuki Ueno, SCREEN Holdings

 

 

Wednesday, July 13
​Room 132, North Hall             

10:30–5:10 pm

Next Generation Flexible Health Monitoring Devices 

Co-presented by:        

Confirmed Speakers:

  • Azar Alizadeh, Senior Material Scientist, GE Global Research

  • Rich Chaney, American Semiconductor

  • ​Melissa Grupen-Shemansky, CTO, Flexible Electronics & Advanced Packaging, SEMI FlexTech

  • Jason Marsh, Director of Technology, NextFlex

  • Jeff Morse, Managing Director, National Nanomanufacturing Network, University of Massachusetts Amherst

  • Mark Poliks, Professor, Thomas J. Watson School of Engineering & Applied Science; Director, Center for Advanced Microelectronics Manufacturing, Binghamton University

  • Xina Quan, Senior Consulting Engineer, Stanford University​

  • Laura Rea, Program Manager, Air Force Research Laboratory

  • Paul Semenza, NextFlex

  • Perry Skeath, Ph.D., Assistant Director of Research, Arizona Center for Integrative Medicine

  • Travis Stevens, VP Engineering, Orpyx

  • Bob Street, PARC, a Xerox company

  • Jeffrey Stuart, Lockheed Martin

  • Tairan Wang, AFFOA

Registration

 

 

Single Session Price

Ends June 3

Starts June 4

     

SEMI and FlexTech Alliance Members

$299

$399

Non Members

$399

$499

 

 

 

 

Bundle Price: Register for both sessions and SAVE!*  

Ends June 3

Starts June 4

     

SEMI and FlexTech Alliance Members

$508

$678

Non Members

$678

$848

 

*Register for both the Flex Hybrid Electronics Processing and Packaging and Next Generation Flexible Health Monitoring Devices and SAVE!

 

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