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Best of West Award

Showcase your new products by submitting for the Best of West!

Solid State Technology and SEMI are pleased to present the 2016 Best of West Award program. The Best of West Award is given to recognize important product and technology developments in the microelectronics industries. The Best of West Award will provide maximum visibility and value to exhibitor winners, spotlighting exciting new products and technologies in front of a large global audience. All exhibitors are encouraged to participate. Winners will be selected by an independent panel of highly qualified judges. Best of West finalists and award recipients will be selected based on the submission’s financial impact on the industry, engineering or scientific achievement, or societal impact and benefits.

Qualifying Products, Services and Technologies

Consideration for the Best of West awards will be limited to all products, services and technologies publicly introduced from August 1, 2015 to SEMICON West 2016. Submitting companies must be developers of the product or technology (no rep firms or third parties) and must be exhibitors at SEMICON West. SEMI reserves the right to make all final decisions on eligibility. Entries are limited to two per exhibitor.

Categories

  • Wafer Processing Equipment
  • Assembly/Packaging Solutions
  • Metrology and Test
  • Advanced Materials and Materials Management
  • Components and Subsystems
  • Smart Manufacturing
  • Facilities and Software

Call for Entries

Submitting products, services and technologies for consideration is simple. To submit entries for consideration, complete the online form and provide the required descriptions and justifications here. In addition to company name and contact information, a maximum 750-word description of the new product /technology is required, along with a max. 300-word summary of why it’s important submitted in Microsoft Word. Supporting charts, graphs and illustrations must be submitted as part of the Microsoft Word document. Entries that are not submitted in Microsoft Word or otherwise do not follow the above instructions, will be rejected for consideration.

Selection of Finalists

Finalists will be selected by a distinguished panel of judges from academia and the industry.   Finalists will receive recognition for their achievement through press releases, on the SEMICON West website, through online exhibitor directories, and special booth displays.

New for 2016!  Finalists will be given the opportunity to showcase their Best of West product entry at the South TechXPOT Stage on Thursday afternoon.  Finalists will be announced early June.

Selection of Winners

Winners will be announced during SEMICON West and will be selected from the pool of finalists. Judges may visit exhibitors during SEMICON West to obtain further information on the submission.

Congratulations to the Best of West 2016 Winner

   

Coventor: SEMulator3D, South Hall #2622

A 3D semiconductor process modeling platform that can predictively model any fabrication process applied to any semiconductor design. Starting from a "virtual" silicon wafer, the product performs a series of unit processes like those in the fab to create highly accurate 3D computer models of the predicted structures on wafer.  

 

Congratulations to Best of West 2016 Finalists

                 

Coventor: SEMulator3D, South Hall #2622

A 3D semiconductor process modeling platform that can predictively model any fabrication process applied to any semiconductor design. Starting from a "virtual" silicon wafer, the product performs a series of unit processes like those in the fab to create highly accurate 3D computer models of the predicted structures on wafer.  

 

       
 

CyberOptics: WaferSense and ReticleSense Auto Multi Sensor (AMS), South Hall, #2323

Wireless sensor devices capable of multiple measurements ─ leveling, vibration and relative humidity (RH) ─ to save time and expense while improving yields. The WaferSense AMS travels through virtually any tool with its thin and light form factor, while the ReticleSense AMSR has the same measurement capabilities in a reticle shaped form factor.

   
 

Graphenea: Graphene Integration on CMOS-Fab, South Hall #632

Allows large-scale manufacture of 200mm CMOS-compatible graphene wafers (SEMI Standards), with low metal contamination levels. The industrial production method will produce uniform, large-scale/high-performance graphene in high yields and a reliable manner

 
       
 

Kulicke & Soffa Industries: IConn MEM PLUS High Performance Wire Bonder for Memory Devices, North Hall #6060

A new high-performance Memory device bonder for gold and silver alloy wire bonding. With its advanced process, looping, overhang control and ease of use capabilities, it delivers high quality and productivity benefits in complex multi die stack package applications. 

 
       
 

Rorze Automation: Rorze N2 Purged LP, South Hall #1613

Maintains low humidity during critical steps. A typical bottom purged LP can only offer control of an average of 30% RH. However, N2 purge LP from Rorze (patent pending) can offer a humidity control that is better than 5%. 

 
       

 

SPTS Technologies ((An Orbotech Company): Rapier-300S, South Hall #1417 

A production silicon DRIE module, designed specifically for dicing of 300mm wafers mounted on 400mm frames. It builds on SPTS’s experience in plasma singulation of framed 150mm and 200mm wafers, and employs patent-protected end-pointing and process control techniques, critical to delivering stronger die than traditional dicing methods.

 
       

 

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