Thousands of visitors know that the TechXPOTs are the place at SEMICON West to hear about the latest technology developments and breakthroughs in semiconductor manufacturing.


Sessions at the TechXPOTs are aimed at engineers and technologists looking for solutions to key technology challenges and looking to better understand cutting-edge and future technology developments. Developed in conjunction with SEMI technical committees, partner organizations, and technologists, the TechXPOT agenda will provide a deeper view of key technology developments in areas including test, advanced materials and processes, and productivity.


South Hall
Tuesday, July 14, 2015 

What's Next for MEMS?

Strategic briefing on key issues and what is in store for the future of MEMS


Materials Session: Contamination Control in the Sub-20nm Era

A comprehensive picture of how industry value chain participants are collaborating to address contamination control challenges

Hosted by: SEMI CGMG Committee


Wednesday, July 15, 2015 

Subsystem and Component Suppliers at Critical Cross Roads to Deliver on Yield and Productivity 

Examines the critical role of semiconductor components, instruments and subsystems in addressing the challenges of manufacturing at next generation process nodes.


The Evolution of the New 200mm Fab for the Internet of Everything

Explores the role of 200mm fabs and secondary equipment suppliers in supporting anticipated manufacturing demands for IoT devices.

Thursday, July 16, 2015

Monetizing the IoT: Opportunties and Challenges for the Semiconductor Sector

A look at the impact of IoT on the IC industry


The Factory of the Future: Using industrial IoT and 3D Printing in the Semiconductor Manufacturing Sector

Analysis of how disruptive emerging technologies could impact the demanding business of manufacturing semiconductors, equipment and materials



North Hall
Tuesday, July 14, 2015  

Automating Semiconductor Test Productivity

Investigation of strategies for improving Test productivity


Next Generation Memory Technology: MRAM and RRAM Get Close to Commercial

Overview of Next Generation Memory and current challenges for high volume manufacture

 Wednesday, July 15, 2015 

Equipment and Materials Opportunties for Flexible Hybrid Electronics

Examines the opportunities for equipment and materials in the growing market for Flexible Hybrid Electronics 

Session Partner: FlexTech Alliance


Packaging Session: Auto Utopia: Gearing up Semiconductor to turn dreams to reality

Explores semiconductor packaging implications of autonomous driving vehicles

Session Partner: Meptec

Thursday, July 16, 2015

CMP Technical and Market Trends

Discussion of strategic CMP issues

Session Partner: CMP User Group of AVS



Please check back frequently for updates and more information as agendas develop and speakers are announced.

Interested in a sponsorship opportunity? Contact Marlene Sibley at or +1.408.943.6988 today!



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