Thousands of visitors know that the TechXPOTs are the place at SEMICON West to hear about the latest technology developments and breakthroughs in semiconductor manufacturing.


Sessions at the TechXPOTs are aimed at engineers and technologists looking for solutions to key technology challenges and looking to better understand cutting-edge and future technology developments. Developed in conjunction with SEMI technical committees, partner organizations, and technologists, the TechXPOT agenda will provide a deeper view of key technology developments in areas including test, advanced materials and processes, and productivity.


South Hall
Tuesday, July 8, 2014 
10:30am-12:30pm Next Generation MEMS

The growing applications for MEMS sensors and actuators across the expanding range of mobile devices, wearables, and smart objects in the Internet of Things, have increased demand for smaller, smarter, lower power devices—developments that have stimulated a recent surge of innovation in MEMS technologies.  New magnetic and piezoelectric materials, new sensing technology based on changes in resistance or resonant frequency, new gas sensors, new full motion analysis modules, even new approaches like standard modules for ASICs, are making the growing MEMS industry a very dynamic place. That means plenty of new challenges and opportunities for all along the supply chain. Invited industry thought leaders will discuss what to expect next.

1:30pm-3:30pm Variability Control – A Key Challenge and Opportunity for Driving Towards Manufacturing Excellence
Session Partner: SEMATECH

Variability is one of the biggest challenges when CMOS devices are scaled to meet the demand for portable electronics with increased functionality. The problem is that device sizes have been downscaled to the point where the electrical properties of individual devices are very sensitive to small changes in their material properties. A multi-faceted variability reduction approach is needed that comprehends integrates chip design, process and equipment development. 

Wednesday, July 9, 2014 
10:30am-12:30pm Subcomponent Supply Chain Challenges for 10 nm and Beyond
Hosted by: SEMI Semiconductor Components, Instruments, and Subsystems Special Interest Group
This session will cover the challenges faced by sub-component suppliers in the supply chain to OEMs and IDMs with the increased specifications and requirements for 10 nm and beyond. 

Attendees will hear perspectives from leading edge IDMs and OEMs as well as expectations from critical subcomponent suppliers on how to create a more interactive and collaborative supply chain for greater efficiency, increased technology exchanges, and cost improvements at advanced nodes.


Productivity Solutions for 300mm and Smaller
Hosted by the Secondary Equipment and Applications Americas Chapter

With applications as diverse as power management, DNA sequencing, LED, MEMS, and a variety of analog devices, many companies are continuing to innovate on 200mm, 150mm and even smaller substrate sizes.  At the same time, some 300mm equipment has been re-purposed for these applications as well.  Quite a bit of innovation and engineering is going in to increasing productivity in existing fabs - not just through equipment, but also infrastructure, automation, materials handling, facilities, etc.

At the same time, new applications in the More than Moore space, such as devices for the Internet of Things and Wearable Electronics, can take advantage of the cost-efficiencies gained from re-purposing equipment and use of other productivity solutions.  This session will explore innovative engineering solutions that will help to realize manufacturing cost-efficiencies for this broad array of exciting applications.
Thursday, July 10, 2014

3D Printing:  Science Fiction or the Next Industrial Revolution?

Session Partner: SEMICO Research

3D printing is making its mark in almost every field of design, from fashion to art to architecture.  If you can imagine it, you can print it.  The printing process allows designers to make things lighter using materials and techniques they haven’t been able to use before, and to completely customize designs for their application.  3D printing slashes prototype turn-around times from months to weeks, days, or even hours.  This innovative manufacturing method enables engineers to design higher-quality products while reducing time-to-market.


At this ground-breaking session on 3D printing, industry experts will explore how 3D printing can benefit manufacturers:

- How can equipment manufacturers use in-house 3D printing to speed
  up prototyping, lower costs, and protect intellectual property?

- Which manufacturing applications are a good fit for 3D printing?


- How are tool companies already using 3D printing in their processes?


- Can 3D printing be used effectively to manufacture end-use products?

Join Semico Research and representatives from the 3D printing supply chain to find out how this inspiring technology will impact the semiconductor industry. 


North Hall
Tuesday, July 8, 2014  
10:30am-12:30pm Testing into the Future
Hosted by: Collaborative Alliance for Semiconductor Test (CAST) 
The historical barriers between Fab, Assembly and Test are breaking down as new technologies are adopted.  The ITRS Test Roadmap identifies these technologies and CAST activities are directed towards pre-competitive solutions to enable them.  This session will start with updates on the ITRS and CAST activities which will lead into a panel session that will discuss the business implications and opportunities.

Panel: “Seeking Growth”

The Test & Packaging industry segment is in the middle of unprecedented change.  Technology is being driven by adoption of Increased Integration, Advanced Packaging, and Adaptive Test.  However, over the last decade, these sectors have not experienced the same growth rates that their customers have enjoyed.   This panel will explore the current business and technology trends, asking CEOs about their growth strategies in challenging markets, touching on topics that include further consolidation, product diversification and new technologies to give increased value to their customers and shareholders.


1:30pm-3:30pm Speeding on the Roadmap-The Future of 3D NAND Flash
Hosted by: SEMI Chemical and Gases Manufacturers Group (CGMG) Committee

Based on the realization that there are perhaps one or two more shrinks for planar NAND flash devices, several memory producers recently announced plans for various technology approaches to next generation 3D NAND memory devices, with samples expected in 2014.  In comparison to planar NAND, 3D NAND will offer higher endurance, faster write speed and lower power consumption, while at the same time relaxing the lithography requirements.  Instead of a lithography-driven roadmap, and the associated costs of double patterning and other critical lithography steps, memory device producers will rely on advanced etch and deposition processes, which are inherently less expensive than critical lithography processes.  In addition, the need for advanced materials, with low temperature deposition, selective etch, critical clean and planarizing capabilities will also be critical in bring these new 3D NAND technologies to market.


This two hour forum will investigate the markets for new devices; review new device structures; shed light on critical thin film technologies; discuss the implications for materials suppliers, and: allow participants to ask questions of industry leaders.


 Wednesday, July 9, 2014

Bringing Silicon Photonics to Market


The increase of connected technologies and growth of Big  Data are making ever bigger demands on bandwidth and transmission speeds. Data centers are starting to look at using photons instead of electrons to send data faster between servers, and looking seriously at how best to make these high speed photonic connections between chips as well. Wide adoption depends on developing volume manufacturing technology for connecting optics to electronics. Recent progress includes open foundry processes and design support for photonics on silicon, and integration of chips on interposers for standard IC packaging. This session will feature experts in phottonics to update the silicon manufacturing world on these emerging opportunities.


Driving Automotive Innovation-The Enabling Role of Semiconductor and IC Packaging

Session Partner: MEPTEC
Session Chair:  Rich Rice, SVP of Business Development, ASE

Semiconductors are playing a significant role in enabling the sophisticated technology evolution within the automotive sector. The industry has focused on integrating greater intelligence, connectivity, and electronics into today's driving experience. In parallel, the associated semiconductor proliferation is requiring our community to drive innovation for higher performance and increased efficiency. This brings challenges as automotive makers demand rigorous qualification processes, all while maintaining  laser-sharp focus on quality from product design through to production. With features such as infotainment, telematics, electric drivetrains, and self-driving systems poised to become more pervasive options and standard features, the automotive industry is looking to the semiconductor industry to deliver thoroughly reliable and durable technologies. Products emerging in response encompass the most advanced sensors, processors and microcontrollers, and include sophisticated interconnect capabilities. This session will explore the potential for semiconductors in automotive applications, and define ways in which IC packaging can innovate and further evolve to meet the stringent requirements of automobile manufacturers and consumers alike, whose core values ultimately lie in the realm of safety, security and reliability.

Thursday, July 10, 2014 
10:30am-12:30pm Disruptive Compound Semiconductor Technologies 

The unique properties of wide bandgap and compound semiconductor materials make them a promising solution for a variety of applications, from power electronics to mobile front ends, RF devices, photonic LED,  and laser components. The road ahead, however, presents plenty of issues for cost effective volume manufacturing of these devices, from lower cost substrates to high temperature packaging.  Will SiC, GaN or GaN on silicon manage the power for the next generation electric grid and hybrid/electric vehicles? Will GaAs or CMOS dominate mobile front ends?  Invited industry thought leaders will discuss the manufacturing technology challenges and opportunities in moving these high performance materials beyond limited niches to real volume markets in a silicon world.



Please check back frequently for updates and more information as agendas develop and speakers are announced.

Interested in a sponsorship opportunity? Contact Marlene Sibley at or +1.408.943.6988 today!



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