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SESSIONS/EVENTS
Thousands of visitors know that the TechXPOTs are the place at SEMICON West to hear about the latest technology developments and breakthroughs in semiconductor manufacturing. From presentations on cutting-edge materials, to the latest news on next-generation lithography, 450mm, and other major industry initiatives, the TechXPOTs are the place to find out what's new and what's next in microelectronics.
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South Hall |
| Tuesday, July 9, 2013 |
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| 10:30am-12:30pm | Leveraging Nonplanar Transistor Architectures and New Materials to Power Mobility Apps Beyond 20nm |
| The mobile market is
driving the semiconductor industry to continue its move to transistor
architectures that offer greater performance and power benefits than
traditional planar architectures. There is not, however, only one way to
achieve the required performance. IC manufacturers are pursuing different
strategies including leveraging innovations in design rules. To continue the
pace of development below 20nm, however, the industry will need to find
suitable new channel materials and processes (e.g., MOCVD). This session will
present various transistor architecture options below 20nm and the status of
channel materials development. Additionally, inspection and metrology
challenges associated with new materials will be discussed. |
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| 1:30pm-3:30pm | Hosted by the Chemical & Gases Manufacturer Group (CGMG) of SEMI |
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Material markets are growing as the result of opportunities for both large geometry devices and nano-scale devices. This year’s CGMG session will focus on both ends of the device spectrum. Materials innovation is required for larger scale devices such as printable electronics (> 0.5um line widths) as well as sub 22nm (0.022um) semiconductor devices. Presentations will be given on material trends, related materials, as well as market statistics. Come and find out about where materials are used and where the growth is. |
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| Wednesday, July 10, 2013 |
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| 10:30am-12:35pm | Still a Tale of Two Paths: Multi-patterning Lithography at 20nm and Below- EUVL Source and Infrastructure Progress |
| Though progress to take EUVL into the realm of high-volume manufacturing continues to be made, the readiness of the source technologies to take on HVM are still not known with a high degree of certainty. The challenges facing source development are still average power, dose stability and uptime. EUV mask and resist infrastructure readiness activities must also come together in time and address such challenges as defect density (for masks), and line edge roughness, sensitivity, and resolution for resists. No doubt, there will be multiple opportunities to insert EUVL into lower volume production lines - such opportunities will be based on specific products and device applications. Until EUVL is ready for HVM, the industry must continue to rely on double-patterning and even multiple-patterning lithography schemes using 193 immersion lithography to take it beyond 22nm. Speakers will present the current status of EUVL readiness, as well as discuss the current plans and challenges of extending 193i with double- and multiple-patterning. | |
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| 1:30pm-3:30pm |
Productivity Innovation:
Reducing Cost and Improving Performance at 200mm/300mm Wafer Fabs |
| Many of today’s most productive 200mm and 300mm fabs are successful because they excel at rapid changeover and process flexibility, leverage the secondary equipment market for reduced cost and fast ramp up, and deploy the latest advances and ideas in tool and materials productivity. This session will provide practical solutions and ideas to improve productivity at existing lines and fabs, including materials management, use and recovery, secondary equipment solutions, predictive tool maintenance and uptime strategies, energy efficiency, and other ideas for mature process lines and fabs. | |
| Thursday, July 11, 2013 |
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| 10:30am-12:30pm | |
| Increased levels of collaboration, further advancements in tool prototypes, and increased visibility into related supply chain implications have occurred over the past year as the semiconductor industry implements the capability to manufacture its products on 450mm wafers. The SEMICON West 450 Transition Forum will provide the latest updates on the status of 450 R&D, as well as a review of key technology considerations and a discussion of implications and opportunities for the supply chain. The Forum will encompass perspective and updates from chip makers, consortia and suppliers. | |
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| 1:00pm-3:30pm | ITRS Front End of Line Technologies |
| The ITRS is undergoing a major change this year to reflect the market evolution towards highly mobile flexible devices that allow the users to highly customize them to their liking. As a result he new 2013 ITRS will span from Equivalent Scaling to Customized Functionality. These ITRS working groups will discuss the roadmaps that include the system drivers roadmap, and the requirements and potential areas of innovation for continued scaling challenges for future device architectures, device performance challenges, and the modeling tools challenges for future semiconductors. Presentations include those of system drivers, design, modeling and simulation, process integration, devices, and structures (PIDS), lithography, front end processes (FEP), and emerging research devices (ERD). | |
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North Hall |
| Tuesday, July 9, 2013 |
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| 10:30am-12:30pm |
Generation Mobile: Enabled by IC Packaging Technologies Hosted by the Advanced Packaging Committee, SEMI Americas |
| Mobile electronics, with a huge spotlight on the thriving smartphone and tablet market, are fueling growth in semiconductors today, a trend expected to escalate over the years ahead. 'Generation Mobile' relates to consumers worldwide who now rely on such products as a way of life. As demand intensifies for higher performance, greater functionality, and lower power consumption, our industry is experiencing a strong wave of innovation, inspired by those willing to push boundaries and make these increasingly sophisticated products a reality. IC packaging has firmly established itself as a crucial part of the IC and system design process. In that vein, session speakers will discuss today's IC packaging solutions, as well as, explore possibilities for future packaging technologies being poised to enable 'generation mobile' to flourish and infiltrate lifestyles around the globe. | |
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| 1:30pm-4:00pm | Semiconductor Test: Smarter, Faster, More Productive |
| While some may be hopelessly waiting for a reduction in the capital cost of test equipment, most test professionals are exploring ways to improve test accuracy, increase overall equipment efficiency, better integrate ATE into the yield ramp and Total Quality Management systems, and solve difficult test problems in 3DIC and other new devices. This session will explore the latest trends and developments to improve yield, advances in probe card technology, adaptive test integration, and 3DIC test. | |
| Wednesday, July 10, 2013 |
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| 10:30am-12:30pm |
Session Partner: SEMATECH |
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As device dimensions decrease to less than 20 nm nodes, critical defect size also moves into the nanoscale. The technical challenges of finding, identifying, and removing defects at the nanoscale require new infrastructure investments. In this session, the challenges of new inspection and characterization equipment are coupled to fundamentals of defect generation at the nanoscale to describe the integrated nanodefect problem and solutions to enable future semiconductor industry yield enablement. |
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| 1:00pm-3:30pm | Hosted by the Advanced Packaging Committee, SEMI Americas |
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Growing
industry requirement for vertical and heterogeneous integration, as well
as related packaging strategies, remains a crucial focus for many forward-looking
semiconductor supply chain players. While the implementation timeline of
true 3D packaging with TSV technology has been pushed out for many applications,
a number of highly innovative solutions for interposers (2.5D) are already
hitting the market. However, improving process yield and lowering the cost
relative to alternatives are proving resilient bottlenecks to mainstream
2.5D and 3D packaging. Clearly, headway hinges on the delivery of value
appropriate to the function.
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| Thursday, July 11, 2013 |
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| 10:30am-1:00pm | Hosted by the Advanced Packaging Committee, SEMI Americas |
| MEMS technology has
gone a long way since its early conception, helping now billions of
devices to act and collaborate with their ambient. Early adopters from
the car and machining industry
were followed by the mobile phone industry and more recently medical
technology providers.
Not only the sensors have evolved, but also the packaging and integration technologies have gone from controlled stress packaging and housing to allow the functioning of these devices under the required operation conditions, but also selective hermeticity for controlled medium access, the combination of multiple sensors in one device and not to the least integrating intelligence by microcontrollers and even energy supply and wireless transmission solutions were conceptualized and implemented. Especially the latter advancements will be enabling the technological evolution from embedded systems to cyber-physical systems (Industry 4.0 revolution) by autonomous intelligent sensor systems. This session will feature speakers from all parts of the ecosystem to address how future visions will be realized through the heterogeneous integration of MEMS and ICs. |
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| 1:30pm-4:00pm | ITRS Back End of Line Technologies |
| The ITRS is undergoing a major change this year to reflect the market evolution towards highly mobile flexible devices that allow the users to highly customize them to their liking. As a result he new 2013 ITRS will span from Equivalent Scaling to Customized Functionality. These ITRS working groups present the challenges for future interconnects—such as through silicon vias (TSVs); the latest roadmaps for semiconductor assembly; systems packaging applications, “More than Moore” in the ITRS roadmap chapters, and the testing considerations for these quickly changing technologies. They will also discuss the increased focus on applications like micro-electro-mechanical systems (MEMS) and radio frequency and analog/mixed-signal technologies (RFAMS). Presentations include the chapters for interconnect, assembly and packaging, test, MEMS, and RFAMS. | |
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South Hall |
| Tuesday, July 9, 2013 |
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| 10:30am-12:30pm | Adding Value in Next Generation MEMS |
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Recent fast growth for MEMS sensors has quickly turned the niche into a much more mature industry, which has made huge strides towards stable high volume production capability, tinier and lower cost devices, ever improving performance and ease of integration of complex functions, and even faster time to market. But what comes next? How can we capitalize on this advancing technology and maturing manufacturing ecosystem for new applications? As MEMS manufacturing becomes more accessible to more creative minds for ever more applications, what does this mean for traditional suppliers? We’re inviting some industry thought leaders to discuss how companies can use this maturing infrastructure to add new value with new products, new applications, new technologies and new strategies for growing a profitable business. |
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| 1:30pm-3:35pm | Lab-to-Fab: From R&D to High Volume Manufacturing |
| Micro and Nano-electronics innovation today takes place in an environment of enormous technical complexity, time-to-market pressures, and difficult cost constraints. One area where these challenges are most acute is the transition of new products, processes, equipment, and materials from R&D environments to full deployment in high volume manufacturing. This session will explore case histories, best known practices, tools and techniques, and prototype, R&D and development services that will accelerate Lab-to-Fab success and performance. | |
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Wednesday, July 10, 2013 |
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| 10:30am-12:30pm | Building an Infrastructure for Silicon Photonics |
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Ever increasing demand for bandwidth is driving data centers to look seriously at silicon photonics, just as photonics, chip and packaging technologies are making healthy strides towards integrating photonics and silicon at the die, the package, and the board level. We’ve invited a selection of experts across the value chain –from the leading research labs to the key chip and systems makers—to talk about the current state of the technology, the likely solutions for integrating photonics with CMOS, and the industry ecosystem that will be needed to manufacture it. |
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| 1:30pm-3:35pm |
Looking Ahead to the Next Generation of HB LED Manufacturing Technology Hosted by the SEMI LED Steering Committee |
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Though solid-state lighting technology has made stunning progress over the last several years, the market has leveled off as costs still remain too high for mass adoption for general illumination. What are the emerging technologies that could really make a difference going forward? Industry leaders will look at the current state of progress of some of the key developments that could potentially be disruptive, from alternative substrates and critical defect analysis to light extraction strategies and innovative packaging. |
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Thursday, July 11, 2013 |
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| 10:30am-1:30pm | Session Partner: FlexTech Alliance |
| Printed electronics have made great progress in materials and processing technologies for flexible, conformable and robust applications such as wearable biomedical sensors and imagers, displays, consumer packaging, and toxic and structural sensors. Some of the flexible electronics systems incorporate both printed electronics and silicon technology. Various techniques are available for creating very thin silicon chips that can be incorporated in flexible systems. Finding ways to cost effectively and reliably integrate more conventional processors or MEMS sensors or high speed RF communications with printed/flexible electronics systems may open the way to wider applications. Where do printed/flexible electronics systems offer the best solutions? Where could integrating traditional silicon make most sense for cost or performance? What are the remaining challenges and promising solutions for process integration, handling, packaging, integrating and testing hybrid silicon/flexible approaches? | |
| 2:00pm-3:30pm | ITRS CrossCut Technologies |
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The ITRS is undergoing a major change this year to reflect the market evolution towards highly mobile flexible devices that allow the users to highly customize them to their liking. As a result he new 2013 ITRS will span from Equivalent Scaling to Customized Functionality. These ITRS working groups will present their 2012 roadmap topics that are pervasive throughout the industry, such as green chemistry, sustainability issues, and the future requirements of factory and materials sciences as the industry progresses to the next generation of semiconductors and their applications. In addition, disciplines of metrology and yield enhancement supporting the above fields of research round out the presentations and panel discussions. Presentations include factory integration, environment, safety, and health (ESH), metrology, yield enhancement, and emerging research materials (ERM). |
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Please
check back frequently for updates and more information as agendas develop and
speakers are announced.
Interested in a sponsorship opportunity? Contact Marlene Sibley at msibley@semi.org or +1.408.943.6988 today!
