SEMICON West - TechXPOTS

North Hall

Major Sponsor:

Thousands of visitors know that the TechXPOTs are the place at SEMICON West to hear about the latest technology developments and breakthroughs in semiconductor manufacturing. From presentations on cutting-edge materials, to the latest news on next-generation lithography, 450mm, and other major industry initiatives, the TechXPOTs are the place to find out what's new and what's next in microelectronics.

A complete schedule of TechXPOT sessions will be available in April. Please check back for updates and more information as agendas develop and speakers are announced!

Tuesday, July 13

10:30am-12:30pm

“Bridging the Gap”

Mobile Devices – cell phones, smart phones, tablets, and others – have demonstrated that raw IC performance alone is not sufficient to meet dynamic market needs. Packaging innovations, such as SiP and wafer level packaging, are being fully utilized to bridge the gap. This forum is designed to highlight the tremendous collaborative synergy across the electronics ecosystem, striving to meet market demands. What will be the next step? How will 3D Packaging and 3D IC be harnessed to provide the “coolest” mobile device products to meet the needs of the consumers and markets of the future?

2:00pm-4:30pm

“Diving into Deep Submicron– Swimming the Channel”

As the industry moves into implementation of deep submicron semiconductor technologies – 32nm to 28 nm with fragile low k dielectric materials – the issues connected with chip-package-interactions (CPI) are becoming prominent. How can the physical stresses from the package (flip chip and wire bond) be sustained in the die during processing and field operations? In CPI, the collaboration between the wafer foundry and IC package design and assembly, and system application are becoming increasingly significant. What are the technical issues and solutions for different applications? In this forum, we have brought together leaders from the electronics ecosystem to share their ideas and experiences in addressing this extremely important topic.

Wednesday, July 14

10:30am-1:00pm

Advanced Processing and Materials

The demand for higher performance continues to drive the incorporation of new devices and technologies into semiconductor manufacturing. The new devices require new materials like high k gate and capacitor dielectrics, low k interlayer dielectrics, and engineered substrates. This session will feature presentations by device makers, equipment manufacturers, research labs and material suppliers describing these new technologies and how they have been or will be integrated into production.

2:00pm-4:30pm

Advanced Lithography

Lithography is a critical element in the development of new devices. Shrinking dimensions, new materials and increasingly complex structures present challenges to lithographers. In this session noted lithography experts will present their opinions on what part the various technology options– immersion, EUV, direct write, imprint, or directed self-assembly – will play in the manufacturing of semiconductors over the next few years..

Don't miss Extreme Electronics!

The TechXPOT is not the only place to connect with great technical content—don't miss the schedule of technical sessions at the Extreme Electronics stage, located in South Hall. "Mini-conference" session topics include MEMS, energy applications, high-brightness LED (HB LED) manufacturing, and printed/flexible electronics. Check out the agenda on the Extreme Electronics page.

semicon west2010

Sessions/Events

North Hall

Tuesday, July 13

Wednesday, July 14

Don't miss Extreme Electronics!



10:30am-12:30pm	“Bridging the Gap”
	Mobile Devices – cell phones, smart phones, tablets, and others – have demonstrated that raw IC performance alone is not sufficient to meet dynamic market needs. Packaging innovations, such as SiP and wafer level packaging, are being fully utilized to bridge the gap. This forum is designed to highlight the tremendous collaborative synergy across the electronics ecosystem, striving to meet market demands. What will be the next step? How will 3D Packaging and 3D IC be harnessed to provide the “coolest” mobile device products to meet the needs of the consumers and markets of the future?
2:00pm-4:30pm	“Diving into Deep Submicron– Swimming the Channel”
	As the industry moves into implementation of deep submicron semiconductor technologies – 32nm to 28 nm with fragile low k dielectric materials – the issues connected with chip-package-interactions (CPI) are becoming prominent. How can the physical stresses from the package (flip chip and wire bond) be sustained in the die during processing and field operations? In CPI, the collaboration between the wafer foundry and IC package design and assembly, and system application are becoming increasingly significant. What are the technical issues and solutions for different applications? In this forum, we have brought together leaders from the electronics ecosystem to share their ideas and experiences in addressing this extremely important topic.



10:30am-1:00pm	Advanced Processing and Materials
	The demand for higher performance continues to drive the incorporation of new devices and technologies into semiconductor manufacturing. The new devices require new materials like high k gate and capacitor dielectrics, low k interlayer dielectrics, and engineered substrates. This session will feature presentations by device makers, equipment manufacturers, research labs and material suppliers describing these new technologies and how they have been or will be integrated into production.
2:00pm-4:30pm	Advanced Lithography
	Lithography is a critical element in the development of new devices. Shrinking dimensions, new materials and increasingly complex structures present challenges to lithographers. In this session noted lithography experts will present their opinions on what part the various technology options– immersion, EUV, direct write, imprint, or directed self-assembly – will play in the manufacturing of semiconductors over the next few years..