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North Hall

Wednesday, July 14, 2010, 2:00pm–4:30 pm

Advanced Lithography

 

Lithography is a critical element in the development of new devices. Shrinking dimensions, new materials and increasingly complex structures present challenges to lithographers. In this session noted lithography experts will present their opinions on what part the various technology options– immersion, EUV, direct write, imprint, or directed self-assembly – will play in the manufacturing of semiconductors over the next few years.

2:00pm–2:05pm

Introduction
Bryan Rice
Director of Lithography
Sematech

   

2:05pm–2:25pm

Nano Imprint
(Presentation in PDF)

Ben Eynon (Biography)
VP of Semiconductor Business Development
Molecular Imprints

   

2:25pm–2:45pm

Design Technology Co-Optimization – Multidisciplinary Solution for the Scaling Limitation
(Presentation in PDF)

Jongwook Kye, Ph.D. (Biography)
GLOBALFOUNDRIES

   

2:45pm–3:05pm

A Consortia Based Approach to Provide a Cost Effective, Integrated Platform for EUV Lithography
(Presentation in PDF)

Michael D. Tittnich (Biography)
Associate VP of Technical Operations
College of Nanoscale Science and Engineering

   

3:05pm–3:25pm

EUV
(Presentation in PDF)

Hans Meiling, Ph.D. (Biography)
ASML

   

3:25pm–3:45pm

Insertion Status of Multibeam Lithography for Semiconductor Manufacturing
(Presentation in PDF)

Laurent Pain, Ph.D. (Biography)
CEA-LETI

   

3:45pm–4:05pm

Directed Self Assembly
(Presentation in PDF)

William Hinsberg, Ph.D. (Biography)
Research Staff Member and Manager, Patterning Materials
IBM Corporation

   

4:05pm–4:25pm

Challenges Facing the Mask Makers
(Presentation in PDF)

Naoya Hayashi, Ph.D. (Biography)
Research Fellow
Dai Nippon Printing Co., Ltd.

   

4:25pm–4:30pm

Session Wrap up
Bryan Rice
Director of Lithography
Sematech

   

Session Moderator:

Bryan Rice, Director of Lithography, Sematech

 

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