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North Hall

Wednesday, July 14, 2010, 10:30am–12:30pm

Test Solutions

 

The current economic climate combined with the increasing dominance of consumer driven markets has created enormous pressures to lower the cost of test and develop new solutions to solve tough test problems. At the same time these cost pressures rise to new heights, advanced chip features, system functionality, performance goals, and package types have demanded continued innovation and advanced solutions in test. This session will explore the latest innovations in test technologies and ideas that meet today’s need for lower costs, system solutions and new test requirements.

 

 

10:30am–10:50am

“Simplified Test-in-Tray Technology”
(Presentation in PDF)

Thomas Di Stefano (Biography)
President
Centipede Systems

   

10:50am–11:10am
 

“Test in Carriers - The New Test Solution”
(Presentation in PDF)

Bernhard Lorenz (Biography)
Director Engineering
Multitest

   

11:10am–11:30am
 

“Innovative System Test Solution for RF Modules”
(Presentation in PDF)

John Lukez (Biography)
Director of Product Marketing
Lite Point Corporation

   

11:30am–11:50am
 

“Test Operations Optimization and Adaptive Test Proliferation Across Enterprises”
(Presentation in PDF)

Debbora Ahlgren (Biography)
Vice President, Sales & Marketing
OptimalTest

   

11:50am–12:10pm
 

“Construction of Wafermaps for Analysis of Post-Packaging Final Test Data”
(Presentation in PDF)

Wesley Smith (Biography)
Director, Applications Engineering
Galaxy Semiconductor

   

12:10pm–12:30pm
 

“Accelerating Yield Ramps with On-Tester Scan Diagnosis”
(Presentation in PDF)

Jacob Orbon (Biography)
Director of Yield Products, DfX Solutions
Verigy

   


Session Moderator
:


Robert Watson, STATS ChipPAC (Biography)

 

 
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