SESSIONS/EVENTS

SEMICON West 2013 Speakers by Company

                       
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C  D  E   F  G  H  I  J  K 
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U 
V 

X 
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Z



A
Advanced Packaging & System Technology Laboratories Dev Gupta

Package level Interconnects - the Road Ahead, from Flip Chips to TSVs to Active Interconnects


Advanced Micro Devices Patrick Conreaux Test Vision 2020
Advantest Angarai Sivaram

Semiconductor Test: Smarter, Faster, More Productive
 

ALSI Rene Hendriks

Multi Beam Low-K Grooving Evaluation vs Various Removal Principals

 

Alta Devices Nasreen Chopra

4th Annual SEMI North American PV Fab Managers Forum

 

Altera Corporation John Xie

Advancing 2.5D and 3D Packaging through Value Engineering

 

American Semiconductor Douglas R. Hackler

Integrating Conventional Silicon in Flexible Electronics

 

Amkor Technology Ron Huemoeller

Advancing 2.5D and 3D Packaging through Value Engineering

 

Amkor Technology

Roger St. Amand

Generation Mobile:Enabled by IC Packaging Technologies

Applied Materials

Adam Brand

Leveraging Nonplanar Transistor Architectures and New Materials to Power Mobility Apps Beyond 20nm

Applied Materials
Kirk Hasserjian

SEMICON West 450mm Transition Forum

 

Applied Materials

Neil Morrison

 

FlexTech Alliance Workshop: Emerging Materials and Processes for Transparent Conductors

Applied Materials

 

Jim Mullin

International Technology Roadmap for PV (ITRPV) Workshop

 

Applied Materials John Cummings

Productivity Innovation: Reducing Cost and Improving Performance at 200mm/300mm Wafer Fabs

 

Applied Materials Raelene Wong

Business Continuity Planning in the Context of Sustainability

 

Applied Materials
Song-Moon Suh Addressing Nanodefectivity
 

ASE

William Chen

 Advancing 2.5D and 3D Packaging through Value Engineering

 

ASE Calvin Cheung

Advancing 2.5D and 3D Packaging through Value Engineering


ASE

John Hunt

Generation Mobile: Enabled by IC Packaging Technologies
 

ASE Ou Li

IEEE/CPMT Workshop on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era

 

ASE Rich Rice

Generation Mobile: Enabled by IC Packaging Technologies

 

ASET (Association of Super-Advanced Electronics Technologies)

 

Hiroaki Ikeda

Advancing 2.5D and 3D Packaging through Value Engineering

ASML Bert Planting

450mm Manufacturing EHS and Facilities Seminar

 

ASML

Skip Miller

Still a Tale of Two Paths: Multi-patterning Lithography at 20nm and Below- EUVL Source and Infrastructure Progress

AT&S

Johannes Stahr

IEEE/CPMT Workshop on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era
 

Azzurro Semiconductors

Alexander Loesing

Looking Ahead to the Next Generation of HB LED Manufacturing Technology
 

B

BodyMedia

Ivo Stivoric

Adding Value in Next Generation MEMS

Brewer Science

Stephen Gibbons

 

Lab-to-Fab: From R&D to High Volume Manufacturing

Brewer Science James Lamb

FlexTech Alliance Workshop: Emerging Materials and Processes for Transparent Conductors

 

Broadcom Corporation Tom Gregorich

Generation Mobile: Enabled by IC Packaging Technologies

 

Broadcom Corporation

Steve Ledsinger

 

Test Vision 2020

Bridgelux

Max Hong

Looking Ahead to the Next Generation of HB LED Manufacturing Technology

 

C
Cambrios Technologies Rahul Gupta

FlexTech Alliance Workshop: Emerging Materials and Processes for Transparent Conductors

Cascade Microtech, Inc. Eric Hill 3D Stacked Die Test
Carestream Health Robert Monson

FlexTech Alliance Workshop: Emerging Materials and Processes for Transparent Conductors

 

CEA-Leti

Laurent Malier

SEMICON West 2013 R&D Panel–
“A Conversation on the Future of Semiconductor Technology”

 

CH2M Hill Andy Solberg

450mm Manufacturing EHS and Facilities Seminar

 

Cisco Systems Li Li

Advancing 2.5D and 3D Packaging through Value Engineering


Cisco Systems

Mark Nowell

Building an Infrastructure for Silicon Photonics
 

Cisco Systems Jie Xue

IEEE/CPMT Workshop on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era

 

College of Nanoscale Science
and Engineering (CNSE)

Michael Liehr

SEMICON West 2013 R&D Panel–
“A Conversation on the Future of Semiconductor Technology”


Coventor

David Fried

Lab-to-Fab: From R&D to High Volume Manufacturing
 

Cowen and Company

Tim Arcuri

Bulls and Bears

Cravath, Swaine, & Moore David Kappos SEMI Global Intellectual Property Summit: The Road Ahead?
D
Distributed Sun  Chase Weir

SEMI PV Materials and Reliability Expert Forum

 

Dai Nippon Printing Co., Ltd. Satoru Kuramochi

MEMS & Sensor Packaging for the Internet of Things

 

Dow Chemical Tom Taylor

Materials Growth Opportunities at Both Ends of the Spectrum

 

DuPont Eric Romano

SEMI PV Materials and Reliability Expert Forum

 

E
Edwards Adrienne Pierce

450mm Manufacturing EHS and Facilities Seminar

 

Edwards Vacuum Sia Abbaszadeh

Addressing Nanodefectivity

 

 

Entegris

Bertrand Loy

SEMICON West 2013 Executive Panel– “A Promising but Challenging Future”
 

ERM Gary Lucks Addressing EHS Regulations for High Tech Manufacturing
EV Group Thorsten Matthias MEMS & Sensor Packaging for the Internet of Things
EUV Litho Vivek Bakshi
Still a Tale of Two Paths: Multi-patterning Lithography at 20nm and Below- EUVL Source and Infrastructure Progress
F
FabMax Eduard Hoeberichts

Productivity Innovation: Reducing Cost and Improving Performance at 200mm/300mm Wafer Fabs

 

Facilities 450mm Consortium Allen Ware

450mm Manufacturing EHS and Facilities Seminar

 

Facilities & Safety Solutions Aaron Zude

Business Continuity Planning in the Context of Sustainability

 

Fairchild Semiconductor Janusz Bryzek

MEMS & Sensor Packaging for the Internet of Things

 

FEI Company

Don Kania

Bulls and Bears
 

Feldman Engineering

Ira Feldman

 

Test Vision 2020
FlexTech Alliance

Michael Ciesinski

 

FlexTech Alliance Workshop: Emerging Materials and Processes for Transparent Conductors

 

Integrating Conventional Silicon in Flexible Electronics

 

Flextronics

 

Scott Graybeal

4th Annual SEMI North American PV Fab Managers Forum

 

Flextronics

 

Erik Volkerink

Test Vision 2020

 

Foresite Systems Travis Miller

Addressing EHS Regulations for High Tech Manufacturing

 

Fraunhofer IZM Rolf Aschenbrenner

IEEE/CPMT Workshop on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era

 

Fraunhofer IZM Klaus-Dieter Lang

MEMS & Sensor Packaging for the Internet of Things

 

FUJIFILM Dimatix Darrell Etter

FlexTech Alliance Workshop: Emerging Materials and Processes for Transparent Conductors

 



 

 

G
Gartner David Christensen SEMI/Gartner Market Symposium
 
Gartner Bob Johnson SEMI/Gartner Market Symposium
 

Georgia Tech University

 

Abhijit Chatterjee Test Vision 2020
GCL Solar Sean Tzou

4th Annual SEMI North American PV Fab Managers Forum

 

Gestamp Solar

 

Pablo Otin

SEMI PV Materials and Reliability Expert Forum

 

Global 450mm Consortium Frank Robertson

450mm Manufacturing EHS and Facilities Seminar

 

Global 450mm Consortium Paul Farrar

SEMICON West 450mm Transition Forum

 

GLOBALFOUNDRIES

 

Paul Besser

Materials Growth Opportunities at Both Ends of the Spectrum

 

GLOBALFOUNDRIES David Duke

Productivity Innovation: Reducing Cost and Improving Performance at 200mm/300mm Wafer Fabs

 

GLOBALFOUNDRIES Subramani Kengeri Leveraging Nonplanar Transistor Architectures and New Materials to Power Mobility Apps Beyond 20nm
 

GLOBALFOUNDRIES

Ajit Manocha

SEMICON West Opening Keynote

GLOBALFOUNDRIES
Singapore Pte. Ltd.

 

Rakesh Kumar

Adding Value in Next Generation MEMS
 

 
H Hugh Kuhn SEMI PV Materials and Reliability Expert Forum
HAK Solar Advisory Services
Hitachi Chemical Itsuo Watanabe

Advancing 2.5D and 3D Packaging through Value Engineering


 
I

IBM

George Gomba

Leveraging Nonplanar Transistor Architectures and New Materials to Power Mobility Apps Beyond 20nm

IBM Gerd Pfeiffer Silicon Wafers - Future Standardization to Enable the Transition
IBM Brian Sundolf, PhD Volumetric Scaling and the Need for Heterogeneous Integration

IBM

Yurii Vlasov

Building an Infrastructure for Silicon Photonics
 

imec

Luc Van den hove

SEMICON West 2013 R&D Panel–
“A Conversation on the Future of Semiconductor Technology”

Infrastructure Advisors Ron Leckie

Adaptive Test - Steps to Industry Wide Implementation

Integrated Photovoltaics

 

Sharone Zehavi

4th Annual SEMI North American PV Fab Managers Forum

 

Intel Dawn Graunke

Business Continuity Planning in the Context of Sustainability

 

Intel

Mostafa Aghazadeh

IEEE/CPMT Workshop on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era

 

Intel Mike Goldstein Silicon Wafers - Future Standardization to Enable the Transition
 

Intrinsiq Materials

 

Richard Dixon

Materials Growth Opportunities at Both Ends of the Spectrum

 

Introspect Technology

 

Mohamed Hafed Test Vision 2020
Invensas Corporation Simon McElrea Interconnectology! The Shift from 'Advanced Packaging' to 'Advanced Interconnect'
J

Jabil

 

Quyen Chu Integrating Conventional Silicon in Flexible Electronics
 

The Joint School of Nanoscience and Nanoengineering, Greensboro, North Carolina

 

Daniel Herr

Materials Growth Opportunities at Both Ends of the Spectrum

JSR Corporation 

Nobu Koshiba

SEMICON West 2013 Executive Panel– “A Promising but Challenging Future”

 

K

KLA Tencor
Steven Chen Looking Ahead to the Next Generation of HB LED Manufacturing Technology

KLA Tencor Paul MacDonald
Addressing Nanodefectivity

KLA Tencor Brian Trafas

SEMICON West 450mm Transition Forum

 

Korean Intellectual Property Office (KIPO) Hyuk Jung Kwon SEMI Global Intellectual Property Summit: The Road Ahead?
 

Kotura

 

Mehdi Asghar

Building an Infrastructure for Silicon Photonics

 

KPMG Ron Steger

Advancing 2.5D and 3D Packaging through Value Engineering


Kyocera

Koichi Nonomura

IEEE/CPMT Workshop on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era

 

L
Lam Research Brian Claes

Addressing EHS Regulations for High Tech Manufacturing

 

Lam Research

Martin Anstice

SEMICON West 2013 Executive Panel – “A Promising but Challenging Future”

 

Lam Research Mark Fissel

SEMICON West 450mm Transition Forum

 

Lazard Capital

 

Sanjay Shrestha

 

4th Annual SEMI North American PV Fab Managers Forum

 

Linx Consulting, LLC

 

Michael Corbett

Materials Growth Opportunities at Both Ends of the Spectrum

 

SEMI PV Materials and Reliability Expert Forum

 

LTX Credences Steve Wigley Test Vision 2020

Luxtera

Peter De Dobbelaere

Building an Infrastructure for Silicon Photonics
 

M
M&W Group Allen Ware

450mm Manufacturing EHS and Facilities Seminar

 

M&W Group/G450C Allen Ware

Silicon Wafers - Future Standardization to Enable the Transition

 

M&W Group Don Yeaman

450mm Manufacturing EHS and Facilities Seminar

 

Matheson

 

Bruce Adams

SEMI PV Materials and Reliability Expert Forum

 

MC10 Brian Elolampi
Integrating Conventional Silicon in Flexible Electronics
McKinsey & Company Stefan Heck 4th Annual SEMI North American PV Fab Managers Forum

MEMC

 

Milind Kulkarni

4th Annual SEMI North American PV Fab Managers Forum

 

MEMC Solar Materials Ali Nouri

SEMI PV Materials and Reliability Expert Forum

 

Mentor Graphics Martin Keim

Semiconductor Test: Smarter, Faster, More Productive

 

Test Vision 2020

 

Mentor Graphics Steve Pateras Ensuring FinFET Defect Coverage with Cell-Aware Test

Mentor Graphics

Wally Rhines

SEMICON West 2013 Executive Panel– “A Promising but Challenging Future”

Mentor Graphics

Joe Sawicki

Leveraging Nonplanar Transistor Architectures and New Materials to Power Mobility Apps Beyond 20nm

Metropolitan Manufacturers Liz Aton Business Continuity Planning in the Context of Sustainability

Micron

Scott Graham

IEEE/CPMT Workshop on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era

 

Multitest Bernhard Lorenz Quality in 3D Production - Special Handling Requirements in Final Test
Multitest Electronics Systems
James Quinn

Semiconductor Test: Smarter, Faster, More Productive

 

Test Vision 2020

 

N

Nanium

Jose Campos

IEEE/CPMT Workshop on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era 
 

 

Nanotech Biomachines, Inc. Will Martinez

FlexTech Alliance Workshop: Emerging Materials and Processes for Transparent Conductors

 

National Instruments

 

Luke Schreier

Semiconductor Test: Smarter, Faster, More Productive

 

Open Hardware Standards for Semiconductor ATE

 

Nikon Precision Hamid Zarringhalam

SEMICON West 450mm Transition Forum

 

Nikon Research Corporation
of America

Stephen Renwick

Still a Tale of Two Paths: Multi-patterning Lithography at 20nm and Below- EUVL Source and Infrastructure Progress

 

NovaCentrix Andrew Edd

FlexTech Alliance Workshop: Emerging Materials and Processes for Transparent Conductors

 

O
ON Semiconductor Sri Jandhyala

Test Vision 2020

 

OptimalTest Danny Glotter

Semiconductor Test: Smarter, Faster, More Productive

 

Test Vision 2020

 

OptimalTest Gil Levy

Paradigm Shift in the Industry - Escape Prevention

 

Ovivo Lothar Till

450mm Manufacturing EHS and Facilities Seminar

 

P
Palomar Technologies David Rasmussen

Automated High-Reliability Wire Bonding: Machines, Materials and
Methods

 

PARC, a Xerox company Ross Bringans SEMI/Gartner Market Symposium

Philips Lumileds

 

Wouter Soer

Looking Ahead to the Next Generation of HB LED Manufacturing Technology

 

Photonic Controls, LLC B. Roe Hemenway

Building an Infrastructure for Silicon Photonics


Portland State University

Sung Yi

IEEE/CPMT Workshop on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era

 

PricewaterhouseCoopers, LLC   Chris Richard

SEMICON West 450mm Transition Forum

 

Q
Qcept Technologies
Robert Newcomb

Productivity Innovation: Reducing Cost and Improving Performance at 200mm/300mm Wafer Fabs

 

Qualcomm Octavio Martinez Test Vision 2020
R
RASIRC Lita Shon-Roy Business Continuity Planning in the Context of Sustainability

Robert Bosch GmbH

Jiri Marek, Ph.D.

MEMS & Sensor Packaging for the Internet of Things

Roos Instruments Mark Roos

True HVM RF Testing Beyond 20 GHz

 

Test Vision 2020


ROTH Capital Partners, LLC

 

Krishna Shankar Bulls and Bears
Rudolph Technologies Rajiv Roy

Advanced Packaging


S
Samsung/G450C Kwangkook Lee

Silicon Wafers - Future Standardization to Enable the Transition

 

Sandia National Laboratories

 

Dahwey Chu

Integrating Conventional Silicon in Flexible Electronics

 

SEMATECH

Daniel Armbrust

SEMICON West 2013 R&D Panel–
“A Conversation on the Future of Semiconductor Technology”

 

SEMATECH

Paul Kirsch

Leveraging Nonplanar Transistor Architectures and New Materials to Power Mobility Apps Beyond 20nm
 

SEMATECH

Abbas Rastegar

 

Addresing Nanodefectivity

SEMATECH

Stefan Wurm

Still a Tale of Two Paths: Multi-patterning Lithography at 20nm and Below- EUVL Source and Infrastructure Progress

 

SEMI

Thomas Morrow

SEMI/Gartner Market Symposium

 

SEMI

Mark  Stromberg

SEMI/Gartner Market Symposium

 

SEMI

Dan Tracy

SEMI/Gartner Market Symposium

 

SEMI

 

Ray Morgan

4th Annual SEMI North American PV Fab Managers Forum

 

Seren Photonics, Ltd

Carl Griffiths

Looking Ahead to the Next Generation of HB LED Manufacturing Technology

Siconnex Igor Eichinger

Productivity Innovation: Reducing Cost and Improving Performance at 200mm/300mm Wafer Fabs

 

Sinovia Technologies Bill Jackson

FlexTech Alliance Workshop: Emerging Materials and Processes for Transparent Conductors

 

SK Hynix

Minho Kim

Generation Mobile:  Enabled by IC Packaging Technologies
 

SK Hynix Nick (Namseog) Kim

IEEE/CPMT Workshop on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era

 

Solar PV Market Research

 

Paula Mints

4th Annual SEMI North American PV Fab Managers Forum

 

SolarCity, U.S.

 

Jimmy Chuang

4th Annual SEMI North American PV Fab Managers Forum

 

Solexant

 

Brad Mattson

4th Annual SEMI North American PV Fab Managers Forum

 

Silicon Innovation Forum

Stifel, Nicolaus & Co.

Patrick Ho

Bulls and Bears
 

STATS ChipPAC Raj Pendse

Advancing 2.5D and 3D Packaging through Value Engineering

 

STMicroelectronics

Michel Haond

Leveraging Nonplanar Transistor Architectures and New Materials to Power Mobility Apps Beyond 20nm

STMicroelectronics Yan Loke

Adding Value in Next Generation MEMS

 

Strategic Counsel Holly Evans Addressing EHS Regulations for High Tech Manufacturing
SUMCO Hisashi Furuya Silicon Wafers - Future Standardization to Enable the Transition
 
SunEdison Sean Kiernan

4th Annual SEMI North American PV Fab Managers Forum

 

Susquahanna International Group

 

Mehdi Hosseini

Bulls and Bears

Synopsys

Mike Rieger

Still a Tale of Two Paths: Multi-patterning Lithography at 20nm and Below- EUVL Source and Infrastructure Progress
 

T
TechInsights John Scott-Thomas Generation Mobile:Enabled by IC Packaging Technologies
TechSearch International E. Jan Vardaman

Advancing 2.5D and 3D Packaging through Value Engineering


Teikoku Taping Systems Mark Franklin Wafer Bonding and 3D Packaging - Bonding and Debonding

TEL (Tokyo Electron Limited)

Ben Rathsack

Still a Tale of Two Paths: Multi-patterning Lithography at 20nm and Below- EUVL Source and Infrastructure Progress
 

TEL (Tokyo Electron Limited) Akihisa Sekiguchi

SEMICON West 450mm Transition Forum

 

TEL (Tokyo Electron Limited) Toshi Matsuda 450mm Manufacturing EHS and Facilities Seminar
TEL (Tokyo Electron Limited) Toshi Matsuda Business Continuity Planning in the Context of Sustainability
TEL NEXX Thomas Walsh

Advancing 2.5D and 3D Packaging through Value Engineering


Telefunkensemi TDCS Wilbur Catabay

Productivity Innovation: Reducing Cost and Improving Performance at 200mm/300mm Wafer Fabs

 

Teradyne Greg Smith

Most of the Time, Most of  Your Tester is Doing Nothing

 

Test Vision 2020

 

Teradyne Roy Chorev

Test Vision 2020

Terepac Corporation Jayna Sheats

Integrating Conventional Silicon in Flexible Electronics

 

Texas Instruments Scott Gulas Test Vision 2020
Texas Instruments Tony Lendino Test Vision 2020
Texas Instruments Charlie Weinberger

Semiconductor Test: Smarter, Faster, More Productive

 

Texas Instruments

Gina Park

Adding Value in Next Generation MEMS
 

Thin Film Electronics Chandrasekhar Durisety

Integrating Conventional Silicon in Flexible Electronics

 

Third Millennium Test Solutions (3MTS)

W.R. Bill Bottoms

Advancing 2.5D and 3D Packaging through Value Engineering

 

Building an Infrastructure for Silicon Photonics

 

Test Vision 2020

 

TNO Norbert Koster

Addressing Nanodefectivity

 

Touch Display Research Jennifer Colegrove

FlexTech Alliance Workshop: Emerging Materials and Processes for Transparent Conductors

 

TSMC/G450C Pinyen Lin

Silicon Wafers - Future Standardization to Enable the Transition

 

U
Ultratech Manish Ranjan

3D IC / TSV

 

Unipixel Bob Berg

FlexTech Alliance Workshop: Emerging Materials and Processes for Transparent Conductors

 

United Microelectronics Corporation (UMC) Kurt Huang

Advancing 2.5D and 3D Packaging through Value Engineering


United States Patent and Trademark Office (USPTO) Michelle Lee

SEMI Global Intellectual Property Summit: The Road Ahead?

 

University of Tokyo Toshifumi Futamata

SEMI Global Intellectual Property Summit: The Road Ahead?

 

U.S. Department of Energy Douglas Hall

SEMI PV Materials and Reliability Expert Forum

 

U.S. Department of Energy

 

Lidija Sekaric

4th Annual SEMI North American PV Fab Managers Forum

 

U.S. Department of Energy,

First Energy Finance

 

 

David Arfin

4th Annual SEMI North American PV Fab Managers Forum

 

U.S. Geological Survey  Keith Long Business Continuity Planning in the Context of Sustainability

Universal Scientific Industrial (USI)

Harrison Chang

Generation Mobile: Enabled by IC Packaging Technologies
 

V
Vantage Technology Corporation
Michael Fury Lab-to-Fab: From R&D to High Volume Manufacturing
VAT Vacuumvalves AG Thomas Christen
 
Addressing Nanodefectivity

VTT Technical Research
Centre of Finland

Aarne Oja

MEMS & Sensor Packaging for the Internet of Things

X

Xfab

Iain Rutherford

Adding Value in Next Generation MEMS

Y
Yingli Brian Grenko

SEMI PV Materials and Reliability Expert Forum

 

Yole Développement

Jean-Christophe Eloy

Adding Value in Next Generation MEMS

Yole Développement Christophe Fitamant

Materials Growth Opportunities at Both Ends of the Spectrum

 

Emergence of New Technologies in 3D


Yole Développement Eric Virey Looking Ahead to the Next Generation of HB LED Manufacturing Technology

 

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