SESSIONS/EVENTS

SEMICON West 2014 Speakers by Company

                       
A  B 
C  D  E   F  G  H  I  J  K 
L 
M 
N 
O 
P 
Q 
R 
S 
T 
U 
V 

X 
Y 
Z



A
Advanced Energy Randy Heckman Subcomponent Supply Chain for 10nm and Beyond
Advanced Micro Devices Shawn Ironmonger Test Vision 2020
Advanced Micro Devices Neal Edwards Test Vision 2020
Advantest Mani Balaraman Design for Test
Advantest Derek Floyd

Test Vision 2020

 

Advantest Dave Armstrong

Testing into the Future
Hosted by: Collaborative Alliance for Semiconductor Test (CAST)

 

Advantest Angarai Sivaram Design for Test
AGC Electronics America Andrew  Crawford
GSAM 2014
Air Products Andrew B. Johnson GSAM 2014
Alpha - Division of Alent, PLC Gene Kim GSAM 2014
Altera Terry Barrette Test Vision 2020
American Semiconductor  Rich Chaney

FlexTech Alliance Workshop: Flexible Hybrid Electronics for Wearable Applications - Challenges and Solutions

 

Amkor Ron Huemoeller

Embracing what's NEXT – Devices & Systems for Big Data, Cloud and IoT

 

Amkor H.C. Peng

Test Vision 2020

 

Analog Devices Tom Goida

Driving Automotive Innovation-The Enabling Role of Semiconductor and IC Packaging 
Session Partner: MEPTEC

 

Analog Devices Mike Zylinski

Driving Automotive Innovation-The Enabling Role of Semiconductor and IC Packaging 
Session Partner: MEPTEC

 

Applied Materials Er-Xuan Ping

Materials Session: Speeding on the Roadmap-The Future of 3D NAND Flash
Hosted by: SEMI Chemical and Gases Manufacturers Group (CGMG) Committee

 

Applied Materials Jimmy Iskandar

Variability Control – A Key Challenge and Opportunity for Driving Towards Manufacturing Excellence
Session Partner: SEMATECH 

 

Applied Materials Sidda Reddy Kurakula

Yield Session: Defect inspection, reduction challenges at the
sub 20nm nodes 
Session Partner: SEMATECH


Applied Materials Patrick Martin GSAM 2014
Applied Materials Sanjiv Mittal

Breakthrough High Volume Manufacturing Innovations: New Paradigms for the Road Ahead

 

Applied Materials Web Coating GmbH Neil Morrison

FlexTech Alliance Workshop: Flexible Hybrid Electronics for Wearable Applications - Challenges and Solutions

 

Applied Materials
Elie Rahme

Secondary Equipment for Mobile & Diversified Applications

 

Applied Seals Dalia Vernikovsky

Subcomponent Supply Chain Challenges for 10 nm and Beyond
Hosted by: SEMI Semiconductor Components, Instruments, and Subsystems Special Interest Group  


Arkansas Power Electronics International  Jared Hornberger GSAM 2014
Arrayant Abid Hussain

Internet of Things (IoT) Startup Showcase - an SK Telecom Americas Innopartners Program

 

Arizona State University John Mardinly

Breakthrough Research Technologies

 

ARM Richard Slobodnik Design for Test
ASE Scott Chen

Driving Automotive Innovation-The Enabling Role of Semiconductor and IC Packaging
Session Partner: MEPTEC

 

ASE Group Calvin Cheung

Embracing what's NEXT – Devices & Systems for Big Data, Cloud and IoT

 

ASE (U.S.), Inc. William Chen

Embracing what's NEXT – Devices & Systems for Big Data, Cloud and IoT

 

ASML Hans Meiling

Readiness of Advanced Lithography Technologies for HVM

 

Asset InterTech Al Crouch Test Vision 2020
Aurrion Eric Hall Bringing Silicon Photonics to Market
B
Bayer Material Science LLC Michael T.  Gallagher GSAM 2014
Bosch Software Innovations Cory Plender GSAM 2014
Brewer Science Douglas Guerrero

Readiness of Advanced Lithography Technologies for HVM

 

Brook Instrument
Bill Valentine Variability Control – A Key Challenge and Opportunity for Driving Towards Manufacturing Excellence
Session Partner: SEMATECH
 
C
Cadence Bassilios Petrakis Design for Test
Canon Nanotechnologies Douglas Resnick

Readiness of Advanced Lithography Technologies for HVM

 

Cascade Microtech Ken Smith Test Vision 2020
Cascade Microtech Debbora Ahlgren Test Vision 2020
CEA-Leti Serge Tedesco

Readiness of Advanced Lithography Technologies for HVM

 

CEA-Leti Hughes Metras

Bringing Silicon Photonics to Market

 

ChemiSense Brian Kim

Internet of Things (IoT) Startup Showcase - an SK Telecom Americas Innopartners Program

 

Chirp Microsystems Michelle Meng-Hsiung Kiang

Internet of Things (IoT) Startup Showcase - an SK Telecom Americas Innopartners Program

 

ChipWorks Dick James

Getting to 5nm Devices:
Evolutionary Scaling to Disruptive Scaling and Beyond

 

Cima NanoTech Pte. Ltd Thomas Chang GSAM 2014
Cisco Systems Tao Zhang

Embracing what's NEXT – Devices & Systems for Big Data, Cloud and IoT

 

Cisco Systems Jie Xue Bringing Silicon Photonics to Market

College of Nanoscale Science and Engineering

 

Paul A. Farrar, Jr. 450mm Technology Development
College of Nanoscale Science and Engineering Warren Montgomery

Readiness of Advanced Lithography Technologies for HVM

 

College of Nanoscale Science and Engineering Michael Liehr

Challenges, Innovations and Drivers in Metrology
(Session Partner: SEMATECH)


Compass EOS Shuki Benjamin

Bringing Silicon Photonics to Market

 

Consultant David Busing

Challenges, Innovations and Drivers in Metrology (Session Partner: SEMATECH)

 

Cowen & Company Tim Arcuri

Bulls and Bears

 

Credit Suisse John Pitzer Bulls and Bears
D
D.A. Davidson Avinash Kant Bulls and Bears
Dept of Energy, Wide Bandgap Manufacturing Program Marina Sofos Disruptive Compound Semiconductor Technologies

DuPont Industrial Biosciences Gregg Whited GSAM 2014
E
EDA Consortium Bob Gardner Design for Test
Edwards Adrienne Pierce

Subcomponent Supply Chain Challenges for 10 nm and Beyond
Hosted by: SEMI Semiconductor Components, Instruments, and Subsystems Special Interest Group  

 

Entegris Annie Y. Xia

Yield Session: Defect inspection, reduction challenges at the
sub 20nm nodes   
Session Partner: SEMATECH

 

EV Group Eric Pabo Next Generation MEMS
F
FANUC America Corporation Chris   Blanchette GSAM 2014
FEI Rudy Kellner Bulls and Bears
FlexTech Alliance Malcolm Thompson

FlexTech Alliance Workshop: Flexible Hybrid Electronics for Wearable Applications - Challenges and Solutions

 

Flextronics Joan K.  Vrtis, Ph.D. GSAM 2014
Form Factor Tom St Dennis

Testing into the Future
Hosted by: Collaborative Alliance for Semiconductor Test (CAST
)

 

FormFactor Amy Leong Test Vision 2020
FormFactor Ben Eldridge Test Vision 2020
Formerly of HP, Foxconn and Gentex Happy Holden GSAM 2014
Formerly of Nordson Asymtek Alec Babiarz GSAM 2014

Fraunhofer Institute for Integrated Systems and Device Technology

Lothar Pfitzner

Yield Session: Defectivity and Process Variability-Inspection, Defect Reduction Challenges and Process Controls at the Sub 20nm Nodes

 

Fraunhofer IZM Klaus-Dieter Lang

Disruptive Compound Semiconductor Technologies

 

Fraunhofer Institute Karsten Schischke
Freescale Semiconductor Glenn Daves

Driving Automotive Innovation-The Enabling Role of Semiconductor and IC Packaging
Session Partner: MEPTEC

 

Fujikin Mohamed Saleem Subcomponent Supply Chain Challenges for 10 nm and Beyond
Hosted by: SEMI Semiconductor Components, Instruments, and Subsystems Special Interest Group  
G
Galaxy Semiconductor Steve McDowall Test Vision 2020
Gartner Dean Freeman Test Vision 2020
Gartner Jim Hines

Driving Automotive Innovation-The Enabling Role of Semiconductor and IC Packaging
Session Partner: MEPTEC

 

Gartner Bob  Johnson SEMI/Gartner Market Symposium
Gartner Samuel Wang SEMI/Gartner Market Symposium
Gartner Jim Walker SEMI/Gartner Market Symposium
GE Global Research Chris Keimel Next Generation MEMS

GE Investments - Advanced Manufacturing

 

 

Steven Taub GSAM 2014
Georgia Institute of Technology Oliver Brand

Breakthrough Research Technologies

 

Global 450mm Consortium (G450C) Pinyen Lin 450mm Technology Development
Global 450mm Consortium(G450C) Frank Robertson 450mm Technology Development
GLOBALFOUNDRIES David Duke

Secondary Equipment for Mobile & Diversified Applications

 

GLOBALFOUNDRIES Les Marshall

Subcomponent Supply Chain for 10nm and Beyond

 

GLOBALFOUNDRIES Rohit Pal

Variability Control – A Key Challenge and Opportunity for Driving Towards Manufacturing Excellence
Session Partner: SEMATECH 

 

GLOBALFOUNDRIES Reed Content

Sustainable Manufacturing Forum:

Session 12 - Fabless Considerations in Manufacturing

 

GLOBALFOUNDRIES Ganesh Subramanian

Challenges, Innovations and Drivers in Metrology (Session Partner: SEMATECH)

 

GLOBALFOUNDRIES An Chen

Getting to 5nm Devices:
Evolutionary Scaling to Disruptive Scaling and Beyond

 

GLOBALFOUNDRIES T.M. Mak Test Vision 2020
Google Kaigham Gabriel

Mobility and More–The M&Ms of Cost Beneficial Advanced Packaging
(Session Partner: CMPT)

 

Guardian Industries David  Maikowski GSAM 2014
H
I
IBM Jean Trewhella Bringing Silicon Photonics to Market

IBM Thomas J. Watson
Research Center

 

Qinghuang Lin GSAM 2014
imec An Steegen

Getting to 5nm Devices:
Evolutionary Scaling to Disruptive Scaling and Beyond

 

Inficon William Conner

Variability Control – A Key Challenge and Opportunity for Driving Towards Manufacturing Excellence
Session Partner: SEMATECH 

 

INFRASTRUCTURE Advisors Ron Leckie

Testing into the Future
Hosted by: Collaborative Alliance for Semiconductor Test (CAST)

 

Inpria Andrew Grenville

SIF General Session - Game changer

 

Intel Sanchali Bhattacharjee

Subcomponent Supply Chain for 10nm and Beyond

 

Intel Janice Golda

Getting to 5nm Devices:
Evolutionary Scaling to Disruptive Scaling and Beyond

 

Intel Tim Hendry

Breakthrough High Volume Manufacturing Innovations: New Paradigms for the Road Ahead

 

Intel Sunit Rikhi SEMI/Gartner Market Symposium
Intermolecular Raj Jammy

Getting to 5nm Devices:
Evolutionary Scaling to Disruptive Scaling and Beyond

 

Invensas Charles  Woychick GSAM 2014
IOT Technology Solutions Vincent A. Guarna, Jr.  GSAM 2014
J
Jabil Dan  Gamota GSAM 2014
JCET Steve Liang GSAM 2014
JSR Micro Maria Peterson

Materials Session: Speeding on the Roadmap-The Future of 3D NAND Flash
Hosted by: SEMI Chemical and Gases Manufacturers Group (CGMG) Committee

 

K
KITECH USA Shae Kim GSAM 2014
KLA-Tencor Frank Burkeen

Disruptive Compound Semiconductor Technologies  


KLA-Tencor Jaydeep Khedkar Subcomponent Supply Chain for 10nm and Beyond
KYEC Andrei Berar Test Vision 2020
L
Lam Research Dave Bowser Subcomponent Supply Chain for 10nm and Beyond
Lam Research Thorsten Lill

Breakthrough Research Technologies

 

Linx Consulting Mike Corbett

Materials Session: Speeding on the Roadmap-The Future of 3D NAND Flash
Hosted by: SEMI Chemical and Gases Manufacturers Group (CGMG) Committee

 

Linx Consulting Mark Thirsk

Materials Session: Speeding on the Roadmap-The Future of 3D NAND Flash
Hosted by: SEMI Chemical and Gases Manufacturers Group (CGMG) Committee

 

Luminode Vincent Lee

Internet of Things (IoT) Startup Showcase - an SK Telecom Americas Innopartners Program

 

Luxtera Peter De Dobbelaere Bringing Silicon Photonics to Market
M
Massachusetts Institute of Technology Julie A. Shah GSAM 2014
mc10
Steven Fastert GSAM 2014
MEMS Industry Group Karen Lightman Next Generation MEMS
Mentor Graphics Steve Pateras Design for Test
Mentor Graphics Fan Jiang

Readiness of Advanced Lithography Technologies for HVM

 

Mentor Graphics Geir Eide Test Vision 2020
Mentor Graphics Geir Eide

Yield Session: Defect inspection, reduction challenges at the
sub 20nm nodes 
Session Partner: SEMATECH

 

Micrel, Inc. Wan-Thai Hsu GSAM 2014
Microfabrica Richard Chen 3D Printing: Science Fiction or Next Industrial Revolution
Micron Technology Mark  Adams Opening Keynote
Microsoft Raj Master

Embracing what's NEXT – Devices & Systems for Big Data, Cloud and IoT

 

Microsoft  Sanjay Ravi Keynote
Molecular Imprints David Gino

SIF General Session - Game changer

 

MonolithIC 3D
Brian Cronquist

FlexTech Alliance Workshop: Flexible Hybrid Electronics for Wearable Applications - Challenges and Solutions

 

N
National Instruments Luke Schreier Test Vision 2020
Nikon Precision Hamid Zarringhalam 450mm Technology Development
Nikon Research Corp. of America Stephen Renwick

Readiness of Advanced Lithography Technologies for HVM

 

Nisshin Gulf Coast John Sobchak

Yield Session: Defect inspection, reduction challenges at the
sub 20nm nodes 

 Session Partner: SEMATECH


NIST Joseph Kline

Challenges, Innovations and Drivers in Metrology (Session Partner: SEMATECH)

 

NIST Michael Gaitan Next Generation MEMS
Northfield Automation Systems
Mark Wegner

FlexTech Alliance Workshop: Flexible Hybrid Electronics for Wearable Applications - Challenges and Solutions

 

Northrop Grumman Jim Oliver

Disruptive Compound Semiconductor Technologies

 

Nova Measuring Instruments Cornel Bozdog Challenges, Innovations and Drivers in Metrology (Session Partner: SEMATECH)
nVidia Amit Sanghani Design for Test
O
Oracle John Cunningham Bringing Silicon Photonics to Market
Oregon State University Doug Keszler Breakthrough Research Technologies
P
Pall Corporation Steven Chisolm

Subcomponent Supply Chain Challenges for 10 nm and Beyond
Hosted by: SEMI Semiconductor Components, Instruments, and Subsystems Special Interest Group  


Palo Alto Research Center (PARC) Gregory Whiting

FlexTech Alliance Workshop: Flexible Hybrid Electronics for Wearable Applications - Challenges and Solutions

 

Panasonic Tae Yi GSAM 2014
Particle Measuring Systems Dan Rodier

Challenges, Innovations and Drivers in Metrology (Session Partner: SEMATECH)


Pellucid GPS Tom Wiley Internet of Things (IoT) Startup Showcase - an SK Telecom Americas Innopartners Program
Perkins Coie LLP Bing Ai

Embracing what's NEXT – Devices & Systems for Big Data, Cloud and IoT

 

Perkins Coie LLP Hwa Lee

Embracing what's NEXT – Devices & Systems for Big Data, Cloud and IoT

 

Perkins Coie LLP Kevin Patariu

Embracing what's NEXT – Devices & Systems for Big Data, Cloud and IoT

 

Protocafe Sandra Madrigal 3D Printing: Science Fiction or Next Industrial Revolution
Q
QUALCOMM Incorporated Stein Lundby

FlexTech Alliance Workshop: Flexible Hybrid Electronics for Wearable Applications - Challenges and Solutions

 

Qualcomm Technologies
Michael Campbell Test Vision 2020
Qualcomm Ventures Jack Young Next Generation MEMS
Qualicent Analytics Anil Ghandi

Yield Session: Defect inspection, reduction challenges at the
sub 20nm nodes 
Session Partner: SEMATECH

 

Quantum Global Technologies
Ardeshir Sidhwa Yield Session: Defect inspection, reduction challenges at the
sub 20nm nodes 
Session Partner: SEMATECH
R
Rabbit Proto Alexandre Jais

3D Printing: Science Fiction or Next Industrial Revolution

 

Rite Track Tim Hayden

Secondary Equipment for Mobile & Diversified Applications

 

Roos Instruments Mark Roos Test Vision 2020
Rorze Automation Suresh Biligiri

Yield Session: Defect inspection, reduction challenges at the
sub 20nm nodes 

 Session Partner: SEMATECH

 

Rudolph Technologies Paul McLaughlin

Testing into the Future
Hosted by: Collaborative Alliance for Semiconductor Test (CAST) 


Rudolph Technologies Germany GmbH Marcus Yap Challenges, Innovations and Drivers in Metrology
Session Partner: SEMATECH
S
Salland Engineering Don Hartman Test Vision 2020
Samsung Semiconductor Ryan Smith

Materials Session: Speeding on the Roadmap-The Future of 3D NAND Flash
Hosted b
y: SEMI Chemical and Gases Manufacturers Group (CGMG) Committee

 

SEMATECH Ben Bunday Challenges, Innovations and Drivers in Metrology (Session Partner: SEMATECH)
 
SEMATECH Brian Sapp

Challenges, Innovations and Drivers in Metrology (Session Partner: SEMATECH)

 

SEMATECH Chris Hobbs

Getting to 5nm Devices:
Evolutionary Scaling to Disruptive Scaling and Beyond

 

SEMATECH Michael Lercel

Breakthrough High Volume Manufacturing Innovations: New Paradigms for the Road Ahead

 

SEMATECH Bill Ross

Variability Control – A Key Challenge and Opportunity for Driving Towards Manufacturing Excellence
Session Partner: SEMATECH

 

SEMATECH Abbas Rastegar

Yield Session: Defect inspection, Reduction challenges at the
Sub 20nm nodes 
Session Partner: SEMATECH

 

SEMI Daniel Tracy SEMI/Gartner Market Symposium
SEMI Christian Gregor Dieseldorff SEMI/Gartner Market Symposium
SEMI Rania Georgoutsakou Sustainable Manufacturing Forum: European Updates
Semico Research Corporation Adrienne Downey

3D Printing: Science Fiction or Next Industrial Revolution

 

Semiconductor Manufacturing International Corporation (SMIC)

 

ShiuhWuu Lee GSAM 2014
Silex Microsystems Tomas Bauer Next Generation MEMS
Si-Ware Scott Smyser Next Generation MEMS
Soitec Thomas Piliszczuk

Getting to 5nm Devices:
Evolutionary Scaling to Disruptive Scaling and Beyond

 

Soligie John  Heitzinger

FlexTech Alliance Workshop: Flexible Hybrid Electronics for Wearable Applications - Challenges and Solutions

 

SolMateS Arjen Janssens Next Generation MEMS
SRI International Richard Mahoney GSAM 2014
Stanford University Philip Wong

Getting to 5nm Devices:
Evolutionary Scaling to Disruptive Scaling and Beyond

 

Stifel Nicolaus Partick Ho Bulls and Bears
SUNY/CNSE Christopher Borst Getting to 5nm Devices:
Evolutionary Scaling to Disruptive Scaling and Beyond
T
Teradyne Ken Lanier Test Vision 2020
Teradyne Marc Hutner Test Vision 2020
Teradyne Mark Jagiela

Testing into the Future
Hosted by: Collaborative Alliance for Semiconductor Test (CAST)

 

Teradyne Greg Smith Design for Test
Terepac Corporation Jayna Sheats

FlexTech Alliance Workshop: Flexible Hybrid Electronics for Wearable Applications - Challenges and Solutions

 

Texas Instruments Mike Jarboe Test Vision 2020
Texas Instruments Sameer Pendharkar

Disruptive Compound Semiconductor Technologies  


Texas Instruments Lance Wright

Driving Automotive Innovation-The Enabling Role of Semiconductor and IC Packaging
Session Partner: MEPTEC

 

The University of Texas at Austin, Cockrell School of Engineering

 

Bob Metcalfe
SIF General Session - Keynote
Third Millennium Test Solutions Bill Bottoms Embracing what's NEXT – Devices & Systems for Big Data, Cloud and IoT
Tokyo Electron Julie Bannister

Materials Session: Speeding on the Roadmap-The Future of 3D NAND Flash
Hosted by: SEMI Chemical and Gases Manufacturers Group (CGMG) Committee

 

Tokyo Electron Peter Ventzek

Breakthrough Research Technologies

 

Transphorm Primit Parikh

Disruptive Compound Semiconductor Technologies  


TriQuint Thomas Meier

Disruptive Compound Semiconductor Technologies  


TSMC Douglas Yu

Embracing what's NEXT – Devices & Systems for Big Data, Cloud and IoT

 

TSMC
Burn Lin
Readiness of Advanced Lithography Technologies for HVM 
U
UMC JJ Wu

Breakthrough High Volume Manufacturing Innovations: New Paradigms for the Road Ahead

 

United Technologies Research Center (UTRC)

 

Tahany El-Wardany
GSAM 2014
University of Michigan James Moyne

Variability Control – A Key Challenge and Opportunity for Driving Towards Manufacturing Excellence

 

University of Washington Michael Khbeis Breakthrough Research Technologies
V
VLSI Research G. Dan Hutcheson 450mm Technology Development
X
Xcerra Corporation Reinhart Richter Test Vision 2020
Xcerra Corporation Dave Tacelli Testing into the Future
Hosted by: Collaborative Alliance for Semiconductor Test (CAST
) 
Y
Yamaha Motor Corporation Scott  Zerkle GSAM 2014
 
Yole Développement Eric Virey Disruptive Compound Semiconductor Technologies 
 
Yole Developpement Jean-Christophe Eloy

Next Generation MEMS

 

 

 
Bookmark and Share Google+