Semiconductor R&D

The future of microelectronics design and manufacturing is on display at SEMICON West 2014.

  • Next-generation materials and substrates
  • Advanced transistor design
  • New memory technologies: RRAM, PCRAM, PCM
  • Future process development
  • Advanced and contemporary packaging
  • New test paradigms and solutions
  • More Moore, More than Moore, and Beyond Moore technologies


At SEMICON West, you'll join R&D professionals from the world's leading device and manufacturing technology companies, as well as the world's leading universities and research organizations focused on semiconductor R&D, including: imec, CEA-Leti, CNSE, Sematech, Georgia Institute of Technology (IEN), Arizona State & Dublin City University, RTI, Department of Energy (DOE), DOE, OSU/ONAMI, Xerox (Canada) 

R&D-Focused Programs at SEMICON West 2014

Monday, July 7


imec Technology Forum U.S.
(by invitation only)

San Francisco Marriott Marquis

Tuesday, July 8


Next Generations MEMS

TechXPOT South, South Hall


Silicon Innovation Forum Conference 

Keynote Stage, Moscone Center, North Hall


Leti Day
(by invitation only)

W Hotel

Wednesday, July 9


Bringing Silicon Photonics to Market

TechXPOT North, North Hall

Thursday, July 10


3D Printing: Science Fiction or the Next Industrial Revolution?

Session Partner: SEMICO Research

TechXPOT South, South Hall


Disruptive Compound Semiconductor Technologies

TechXPOT North, North Hall


Breakthrough Research Technologies

TechXPOT South, South Hall


NEW—Semiconductor Technology Symposium (STS)  

Tuesday, July 8-Thursday, July 10

Rooms 130-131

North Hall, Moscone Center

The Semiconductor Technology Symposium is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets, aligned with the latest inputs from the ITRS. Separate session tracks explore the trends shaping near-term semiconductor technology and market developments in areas including 450mm, advanced processes and materials, lithography, packaging, and test.

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