Traditional "front-end" processing technologies—including lithography, deposition, and etch technologies—are continually pushed by the demands of the semiconductor industry's pursuit of Moore's Law and other emerging markets and technologies that, like the semiconductor industry, are seeking further improvements in device design, performance, and manufacturing. As semiconductor devices enter the 22nm node, the industry is already well-focused on the manufacturing challenges and technologies needed to get to 20nm and beyond. Critical technology issues on display and under discussion at SEMICON West 2012 include:

• • • 3D IC: TSV and other 3D configurations
    • Solutions and challenges beyond 22nm
    • Gate-first/gate-last
    • Multi-gate transistor technologies (FinFET, etc.)
    • Lithography (immersion, double-patterning, EUV, e-beam, imprint, source/mask optimization-SMO)
    • EUV technologies: Laser Produced Plasma (LPP), Discharge Produced Plasma (DPP)
    • Atomic Layer Deposition (ALD)
    • GaN
    • New manufacturing technologies for logic ICs and memory ICs
    • New memory technologies: RRAMs, STT-RAMs, PC-RAMs, CAT
    • 450mm

Don't miss new opportunities at Extreme Electronics!

SEMICON West features more for the wafer fabrication community than just semiconductors!

Extreme Electronics—the "show-within-the-show" at SEMICON West focused on new markets and emerging technologies—features technical sessions, presentations, and exhibits focused on MEMS, high-brightness LEDs, flexible electronics, and other new and disruptive technology markets. Sessions at the Extreme Electronics stage will highlight the unique challenges and opportunities for these technologies.

Exhibiting Opportunities Available

Sponsorship opportunities available

Looking for additional visibility and brand exposure with your customers at SEMICON West? Consider one of our many exciting sponsorship opportunities! For more information, contact Marlene Sibley at msibley@semi.org.