Increasing device complexity born of continued device scaling to 22nm and below, three-dimensional device architecture (3D IC, TSV), system-in-package (SiP) and system-on-chip (SoC) devices, and new packaging and interconnect designs, as well as differing requirements for different device types (logic, RF, analog, power, mixed signal, memory, etc.) create ongoing challenges for semiconductor test.

SEMICON West 2012 will address test topics in exhibits from the world's leading test companies and in technical sessions focused on the evolving challenges and changes in semiconductor test. Test topics to be addressed at SEMICON West 2012 include:

• • • Test for 3D IC devices
    • Concurrent test
    • Device interface
    • Adaptive test
    • Test software/test programs

Exhibiting Opportunities Available for Test