Search
SEGMENTS
Increasing device complexity born of continued device scaling to 22nm and below, three-dimensional device architecture (3D IC, TSV), system-in-package (SiP) and system-on-chip (SoC) devices, and new packaging and interconnect designs, as well as differing requirements for different device types (logic, RF, analog, power, mixed signal, memory, etc.) create ongoing challenges for semiconductor test.
SEMICON West 2012 will address test topics in exhibits from the world's leading test companies and in technical sessions focused on the evolving challenges and changes in semiconductor test. Test topics to be addressed at SEMICON West 2012 include:
-
-
- Test for 3D IC devices
- Concurrent test
- Device interface
- Adaptive test
- Test software/test programs
-
Test Sessions at SEMICON West
| Tuesday, July 10 |
|
| 1:30pm-3:30pm |
Semiconductor Test: Adding Value through Yield and Better Data Management TechXPOT North |
| Wednesday, July 11 |
|
|
|
|
| 1:30pm-3:30pm | Highlights of International Test Conference |
| 3:00pm-6:00pm | Test Vision 2020 (Day 1) San Francisco Marriott Marquis |
| Thursday, July 12 | |
| 8:30am-5:00pm | Test Vision 2020 (Day 2) San Francisco Marriott Marquis |
Exhibiting Opportunities Available for Test
|
|
Companies with innovative technologies and solutions for test are invited to exhibit at SEMICON West. Great opportunities are still available – learn moreabout exhibiting at SEMICON West! |
Sponsorship opportunities available
Looking for additional visibility and brand exposure with your customers at SEMICON West? Consider one of our many exciting sponsorship opportunities! For more information, contact Marlene Sibley at msibley@semi.org.