Packaging
With the continued integration of front and back end manufacturing technologies, the increasing complexity of microelectronic devices, and the looming challenges of 450 mm, packaging technologies continue to move higher in consideration in the minds of device designers and manufacturers. 3D systems, cost reduction, yield improvement, new material requirements, and emerging applications are among the key issues shaping the future of packaging on display at SEMICON West 2010.
Packaging Technical Sessions and Events at SEMICON West 2010
10:30am–12:30pm |
TechXPOT: Bridging the Gap – TSV, stacking and other new packaging technologies |
2:00pm–4:00pm |
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1:00pm–5:00pm |
SEMI/SEMATECH Presents: 3D Interconnect Challenges and Need for Standards Workshop |
8:00am–5:00pm |
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2:00pm–4:30pm |
TechSITE North: IMAPS/SEMI Present: Intelligent Uses of Precious Metals in Microelectronics |
8:00am–5:00pm |
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Don't miss new packaging opportunities at Extreme Electronics!
SEMICON West features more for the packaging community than just semiconductors!
Extreme Electronics—the "show-within-the-show" at SEMICON West focused on new markets and emerging technologies—features technical sessions, presentations, and exhibits focused on MEMS, high-brightness LEDs, flexible electronics, and other new and disruptive technology markets. Sessions at the Extreme Electronics stage will highlight the unique packaging challenges and opportunities for these technologies.
Learn more about the Extreme Electronics session agenda.
Exhibiting Opportunities Available for Packaging
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Companies with innovative technologies and solutions for advanced packaging are invited to exhibit at SEMICON West. Great opportunities are still available – learn more about exhibiting at SEMICON West! |
