Advances in microelectronics design are accompanied by new requirements and challenges for packaging. Smaller, more complex devices, as well as devices built for mobile electronics have increasingly unique needs for interconnect, reliability, durability, and thermal management, among others. Additionally, as front-end and final manufacturing processes become more integrated, packaging has become integral to the design, manufacture, and function of microelectronic devices.

Packaging issues are pervasive across SEMICON West 2012, with sessions focused on packaging for ICs (including 3D IC), LEDs, and MEMS. Packaging topics addressed at SEMICON West 2012 include:

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    • 3D IC
    • Fine-pitch interconnects
    • Interconnect and dielectric reliability
    • Wire bond, bump, flip chip
    • Nano materials
    • Thermal management
    • LED packaging
    • MEMS packaging

Don't miss new packaging opportunities at Extreme Electronics

SEMICON West features more for the packaging community than just semiconductors. The Extreme Electronics TechZONE is focused on new markets and emerging technologies and features technical sessions, presentations, and exhibits focused on MEMS, high-brightness LEDs, plastic electronics, and other new and disruptive technology markets. Sessions at the Extreme Electronics TechXPOT stage will highlight the unique packaging challenges and opportunities for these technologies.

Detailed agenda information will be posted in February 2012. Please check back for more information.

Exhibiting Opportunities Available for Packaging