MEMS

MEMS will become nearly an $8 billion business this year, as more and more developing consumer applications go into large-volume production.. Nintendo’s Wii and Apple’s iPhone are among the most visible applications, but the growing market for MEMS will be characterized by diversity of applications ranging from automotive tire pressure monitors to handheld projectors. Ten MEMS companies are already using 8 inch wafers, and twelve more plan to move to the larger diameter in the next 18 months or so. New applications, new integration approaches,, new foundry strategies, and new packaging and test solutions promise to make MEMS manufacturing a center of innovation for the coming decade.

Guide to MEMS Events at SEMICON West

8:30am–5:00pm

MEMS Standards Meetings
Task force sessions on wafer bonding, microtubes, microfluidics, international terminology, reliability, materials characterization through the day. The general MEMS/NEMS committee meeting from 3:00pm-5:00pm will discuss where common testing protocols can best cut costs and improve yields.

Cancelled

MEMS Test and Reliability Short course. Presented by MEMS Industry Group (MIG). Dr. John McKillop discusses test and reliability issues and designing product qualification systems. This will be held at the Downtown San Francisco State University campus - Cancelled

10:30am–12:30pm

Opportunities in MEMS: Growing the Market with New Applications, Integrated Functions, and Faster Time to Volume

Jean-Christophe Eloy will give Yole’s latest market update and discuss the new devices coming into volume production and the new challenges to simplify their use in more systems. STMicroelectronics’ Jalinous Esfandyari and Invensense’s Steve Nasiri discuss the future of MEMS sensors and the trends towards smarter and more integrated, higher volume, lower cost devices. Hewlett-Packard’s Peter Hartwell talks about HP’s new inertial sensors and the wireless networks they enable. MIG’s Karen Lightman moderates a panel with ADI’s Asif Chowdhury, IMT’s John Foster, Micralyne’s Yan Loke and Tekton Consulting’s John McKillop in a discussion of optimizing manufacturing for future MEMS growth. Moscone South, Extreme Electronics TechXpot

2:00pm–4:30pm

Micro Manufacturing for Micro Energy Systems: Progress in Energy Harvesting, Storage and Low Power Systems Technology for Wireless Sensor Networks

Texas Instruments’ Adrian Valenzuela updates on the current status of energy harvesting and micro battery systems enabling wireless sensor networks. IMEC’s Raffaella Borzi and MicroGen Systems Robert Andosca report on progress in MEMS energy harvesting. Leading microbattery suppliers IPS and Cymbet talk about the thin-film energy storage systems that make energy harvesting practical for these sensor systems. Moscone South, Extreme Electronics stage.

Other related Events:

10:30am–1:00pm

Fab 2.0: New opportunities for the “next generation” fab.
Freescale (MEMS) and HP (inkjet heads) are among the companies talking about issues of re-purposing older fabs and using secondary equipment.Moscone South, Techsite South

1:00pm–5:00pm

SEMI/SEMATECH 3D Interconnect workshop: Challenges and Need for Standards
Speakers from Qualcomm, SEMATECH, IMEC, Amkor and others will talk about issues of 3D metrology, bonding, thin wafer handling and via hole characterization and explore where the sector might best benefit from standards to reduce costs and advance adoption of TSV technology. Marriott.

1:00pm–5:00pm

MEMS Energy harvesting and reliability workshop. – Cancelled
Dr. Ravi Doraiswami, research scientist at the University of Maryland, gives a course on MEMS energy harvesting and reliability. Marriott.

11:00am–11:30am

Intelligent Uses of Precious Metals in Microelectronics
The objective of the Intelligent Uses of Precious Metals in Microelectronics TechSITE is to have a unique forum that brings together scientists, engineers, manufacturers, academia, and business people from around the world who have been working in the area of Microelectronic packages and use Precious Metals in their applications. This workshop has been specifically organized to allow for the presentation and discussion of some of the best ways to economize and save cost with a valuable set of commodities.

TechSite North Stage, North Hall, Moscone Center

11:00am–11:30am

Palo Alto Research Center (PARC) presents its work on flexible MEMS sensors on film at the Flexible Electronics session. Moscone South, Extreme Electronics stage.

Exhibiting Opportunities Available for MEMS

Companies with innovative technologies and solutions for MEMS design and manufacturing are invited to exhibit at SEMICON West within the Extreme Electronics zone. Close proximity to the presentation stage plus focused attendee marketing ensures high visibility with visitors focused on and interested in MEMS technologies. Great opportunities are still available – learn more about exhibiting at SEMICON West and Extreme Electronics!

Join the Extreme MEMS Community

Working with our partner SemiNeedle, we are proud to present the Extreme MEMS Online Community. This site serves as a resource for information about MEMS manufacturing, and as a forum for discussions about MEMS. Come learn more about MEMS and join the community today!

semicon west2010

Segments

MEMS

Guide to MEMS Events at SEMICON West

Other related Events:

Exhibiting Opportunities Available for MEMS

Join the Extreme MEMS Community



8:30am–5:00pm	MEMS Standards Meetings Task force sessions on wafer bonding, microtubes, microfluidics, international terminology, reliability, materials characterization through the day. The general MEMS/NEMS committee meeting from 3:00pm-5:00pm will discuss where common testing protocols can best cut costs and improve yields.
Cancelled	MEMS Test and Reliability Short course. Presented by MEMS Industry Group (MIG). Dr. John McKillop discusses test and reliability issues and designing product qualification systems. This will be held at the Downtown San Francisco State University campus - Cancelled



10:30am–12:30pm	Opportunities in MEMS: Growing the Market with New Applications, Integrated Functions, and Faster Time to Volume Jean-Christophe Eloy will give Yole’s latest market update and discuss the new devices coming into volume production and the new challenges to simplify their use in more systems. STMicroelectronics’ Jalinous Esfandyari and Invensense’s Steve Nasiri discuss the future of MEMS sensors and the trends towards smarter and more integrated, higher volume, lower cost devices. Hewlett-Packard’s Peter Hartwell talks about HP’s new inertial sensors and the wireless networks they enable. MIG’s Karen Lightman moderates a panel with ADI’s Asif Chowdhury, IMT’s John Foster, Micralyne’s Yan Loke and Tekton Consulting’s John McKillop in a discussion of optimizing manufacturing for future MEMS growth. Moscone South, Extreme Electronics TechXpot

2:00pm–4:30pm	Micro Manufacturing for Micro Energy Systems: Progress in Energy Harvesting, Storage and Low Power Systems Technology for Wireless Sensor Networks Texas Instruments’ Adrian Valenzuela updates on the current status of energy harvesting and micro battery systems enabling wireless sensor networks. IMEC’s Raffaella Borzi and MicroGen Systems Robert Andosca report on progress in MEMS energy harvesting. Leading microbattery suppliers IPS and Cymbet talk about the thin-film energy storage systems that make energy harvesting practical for these sensor systems. Moscone South, Extreme Electronics stage.



10:30am–1:00pm	Fab 2.0: New opportunities for the “next generation” fab. Freescale (MEMS) and HP (inkjet heads) are among the companies talking about issues of re-purposing older fabs and using secondary equipment.Moscone South, Techsite South
1:00pm–5:00pm	SEMI/SEMATECH 3D Interconnect workshop: Challenges and Need for Standards Speakers from Qualcomm, SEMATECH, IMEC, Amkor and others will talk about issues of 3D metrology, bonding, thin wafer handling and via hole characterization and explore where the sector might best benefit from standards to reduce costs and advance adoption of TSV technology. Marriott.
1:00pm–5:00pm	MEMS Energy harvesting and reliability workshop. – Cancelled Dr. Ravi Doraiswami, research scientist at the University of Maryland, gives a course on MEMS energy harvesting and reliability. Marriott.



11:00am–11:30am	Palo Alto Research Center (PARC) presents its work on flexible MEMS sensors on film at the Flexible Electronics session. Moscone South, Extreme Electronics stage.