3DIC at SEMICON West 2010
In the pursuit of building more functionality into ever-shrinking silicon real estate, device designers and manufacturers have crossed into the third dimension. 3DIC technologies have jumped to the forefront of innovation in the microelectronics industry, touching every aspect of the supply chain from design to final test, with each step and process presenting unique challenges and opportunities.
3DIC technology is in the spotlight at SEMICON West 2010, with technical sessions, keynote presentations, and exhibitors all dedicated to products, technologies, and solutions for 3DIC, including design, device fabrication, packaging, and test.
3DIC Sessions and Events at SEMICON West 2010
ASMC 2010 | |
Keynote: Matt Nowak, Qualcomm | |
TechXPOT Sessions (Location: North Hall) | |
Packaging Session: “Bridging the Gap” | |
Packaging Session: “Diving into Deep Submicron- Swimming the Channel” | |
TechSITE Session (Location: North Hall) | |
3DIC Co-Design Challenges: How to Speed 3DIC Deployment | |
IMAPS/SEMI Workshop | |
Advanced Interconnect Technology Workshop | |
Standards | |
SEMI/SEMATECH Presents: 3D Interconnect Challenges and Need for Standards Workshop | |
SEMATECH Workshop on 3D Interconnect Metrology | |