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In the pursuit of building more functionality into ever-shrinking silicon real estate, device designers and manufacturers have crossed into the third dimension. 3DIC technologies have jumped to the forefront of innovation in the microelectronics industry, touching every aspect of the supply chain from design to final test, with each step and process presenting unique challenges and opportunities.
3DIC technology is in the spotlight at SEMICON West 2012, with technical sessions, keynote presentations, and exhibitors all dedicated to products, technologies, and solutions for 3DIC, including design, device fabrication, packaging, and test.
3D IC and Packaging Events at SEMICON West 2012
| Tuesday, July 10 | |
| 10:30am-12:30pm |
Contemporary Packaging: Achieving Cost Advantage Through Innovation TechXPOT North, North Hall |
| 1:30pm-4:30pm | San Francisco Marriott Marquis |
| Wednesday, July 11 | |
| 1:00pm-3:30pm |
The 2.5 & 3D Packaging Landscape for 2015 & Beyond TechXPOT North, North Hall |
| Thursday, July 12 | |
| 1:00pm-3:30pm | ITRS Back End of Line Technologies (Partner Event) TechXPOT North, North Hall |
Exhibiting Opportunities Available for 3D IC
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Companies with innovative technologies and solutions for advanced packaging and 3D IC are invited to exhibit at SEMICON West. Great opportunities are still available – learn moreabout exhibiting at SEMICON West! |
