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According to industry analysts, Yole Developpment, the market value of all the devices using TSV packaged in 3D in the 3DIC or 3D-WLCSP platforms (CMOS image sensors, ambient light sensors, power amplifiers, RF and inertial MEMS) was worth $2.7B in 2012. It will represent 9% of the total semiconductor value by 2017, reaching almost $40B. 

However, 3DIC technologies have yet to overcome major issues with design tools, test, thermal management, cost reduction, and other barriers.  The exhibitors and TechXPOT programs at SEMICON West will address the latest developments, trends and solutions for 3DIC implementation.


TechXPOT programs will feature sessions on: 

  • • 3DIC Packaging
  • • Packaging Trends in Mobile Applications
  • • Advanced Packaging
  • • 3DIC Test Issues

Exhibiting Opportunities Available for 3D IC

Companies with innovative technologies and solutions for advanced packaging and 3D IC are invited to exhibit at SEMICON West. Great opportunities are still available – learn moreabout exhibiting at SEMICON West!


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