Challenges in Device Scaling TechXPOT—North Hall

Tuesday, July 15, 2008
3:00pm–5:30pm

The 22nm node, expected to be reached by leading semiconductor companies in 2011, will represent a major inflection point for lithography in manufacturing. Haunted by persistent concerns over the manufacturing readiness and cost effectiveness of next generation lithography solutions, the 22nm node may have to rely on 193nm water immersion lithography with potentially extremely design invasive resolution enhancement techniques. In this session, industry luminaries representing design, layout, exposure tooling, and manufacturing integration will share their views on the technical feasibility and financial viability of a patterning solution for 22nm. Will the long reign of optical lithography finally come to an end? Who will dethrone it? Or is there one more node left in 193nm? Will the chemists or computational experts extend the use of 193nm lithography? And what does all this mean for the profitability of our industry? This session is led and moderated by Lars Liebmann, distinguished engineer, IBM.
3:00pm–3:15pm	Optical Lithography for 22nm: Can 193nm Support One More Node? (View Presentation—PDF) Bill Arnold, Chief Scientist & VP of Technology Development Department ASML Holding, U.S.
3:15pm–3:30pm	EUV Lithography: The Road to High Volume Manufacturing (View Presentation—PDF) Bruno LaFontaine, Principal Member of Technical Staff Advanced Micro Devices
3:30pm-3:45pm	Imprint Lithography: Ready for Prime Time? (View Presentation—PDF) Ben Eynon, Vice President, Semiconductor Business Development Molecular Imprints Incorporated
3:45pm-4:00pm	Extending 193nm Litho to 22nm: Is the Problem Physics or Designers? (View Presentation—PDF) Larry Pileggi, Tanoto Professor Carnegie Mellon University
4:00pm-4:15pm	Lithography for 22nm: Will We Have a Viable Solution? (View Presentation—PDF) Richard Brashears, Corporate Vice President Cadence Design Systems
4:15pm-4:30pm	Practical Solutions for Volume Manufacturing (View Presentation—PDF) Burn Lin, Senior Director TSMC
4:30pm-5:30pm	Panel Discussion

Note: Speakers and agenda subject to change.