Packaging Summit
July 15, 2008 10:30am–12:30pm NEW LOCATION: Novellus Theater at the Yerba Buena Center for the Arts
It's a 3D World: Charting the Path to TSV

3D Through Silicon Via (TSV) technology is one of the hottest topics in the industry today. Potential applications for 3D TSV include image sensors, flash, DRAM, processors, FPGAs, and power amplifiers. There is no question that 3D TSV will be adopted, but the timing for mass production depends on how the cost of the new technology compares with that of existing technologies. While image sensors for camera modules are already in volume production, the adoption time for other applications is longer than originally predicted, as is common with the introduction of many new technologies. Design, thermal, and test issues remain a barrier to TSV adoption in some applications, though progress is being made.

The Packaging Summit will be a forum for industry experts and technologists to address 3D TSV.

Presentations will be posted as SEMI receives permission from the authors.

Host and Co-Moderator	Bill Bottoms, Ph.D., chairman NanoNexus
Moderator	E. Jan Vardaman, president TechSearch International, Inc.
	Panelists:
	TSV Technology for 3D Interconnect (view presentation – pdf) Clinton Chao, Ph.D., academician/deputy director, Backend Technology Development Division TSMC
	3D IC Packaging Including TSV (view here) Bob Sankman, assembly pathfinding manager, Assembly Test Technology Development Intel Corporation
	Dr. John U. Knickerbocker, distinguished engineer , manager: System on Package & 3D Integration IBM
	Through Silicon Via Market Drivers and Assembly Challenges (view presentation – pdf) Dr. Robert Darveaux, senior vice president, Packaging Research and Development Amkor
	Design Tools for 3D (view presentation - pdf) Lisa McIlrath, Ph.D., president and CEO R3Logic

Cost:

FREE (pre-registration required). Please arrive early as seating is limited.

If you've already registered for SEMICON West 2008, click the "Add Program" button and follow the log on instructions to add this program to your existing registration.

Discover the latest in Wire Bonding Technology Advanced Technology Workshop on Wire Bonding Monday, July 14, 8:00am-5:00pm Intercontinental Hotel
Don't miss the Packaging Technology sessions at the Test, Assembly, and Packaging TechXPOT! High Density Packaging Tuesday, July 15, 3:00pm–5:00pm Wafer-Level Packaging Wednesday, July 16, 10:30am–1:00pm

View the complete SEMICON West 2008 Schedule of Events