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July 15, 2008
10:30am–12:30pm
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It's a 3D World: Charting the Path to TSV |
3D Through Silicon Via (TSV) technology is one of the hottest topics in the industry today. Potential applications for 3D TSV include image sensors, flash, DRAM, processors, FPGAs, and power amplifiers. There is no question that 3D TSV will be adopted, but the timing for mass production depends on how the cost of the new technology compares with that of existing technologies. While image sensors for camera modules are already in volume production, the adoption time for other applications is longer than originally predicted, as is common with the introduction of many new technologies. Design, thermal, and test issues remain a barrier to TSV adoption in some applications, though progress is being made.
The Packaging Summit will be a forum for industry experts and technologists to address 3D TSV.
Presentations will be posted as SEMI receives permission from the authors.
Host and Co-Moderator
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Bill Bottoms, Ph.D., chairman
NanoNexus
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Moderator
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E. Jan Vardaman, president
TechSearch International, Inc.
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Introduction (Audio; 43 minutes; 30MB mp3)
Allow a few mintues to download or right click on the link and choose “Save Target As . . .”
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Panelists:
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Question and Answer Session (Audio; 77 minutes; 53MB mp3)
Allow a few minutes to download or right click on the link and choose “Save Target As . . .”
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TSV Technology for 3D Interconnect (view presentation – pdf)
Clinton Chao, Ph.D., academician/deputy director, Backend Technology Development Division
TSMC
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3D IC Packaging Including TSV (view here)
Bob Sankman, assembly pathfinding manager, Assembly Test Technology Development
Intel Corporation
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Dr. John U. Knickerbocker, distinguished engineer , manager: System on Package & 3D Integration
IBM
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Through Silicon Via Market Drivers and Assembly Challenges (view presentation – pdf)
Dr. Robert Darveaux, senior vice president, Packaging Research and Development
Amkor
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Design Tools for 3D (view presentation - pdf)
Lisa McIlrath, Ph.D., president and CEO
R3Logic
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View the complete SEMICON West 2008 Schedule of Events
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