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Best of West 2012

Solid State Technology and SEMI are pleased to present the 2012 Best of West product awards program. It is the second time that the two groups are co-hosting the awards program. The Best of West Award is given to recognize important product and technology developments in the microelectronics industries. The Best of West Award will provide maximum visibility and value to exhibitor winners, spotlighting exciting new products and technologies in front of a large global audience. All exhibitors are encouraged to participate. Winners will be selected by an independent panel of highly qualified judges. Best of West finalists and award recipients will be selected based on the submission’s financial impact on the industry, engineering or scientific achievement, or societal impact and benefits.


Qualifying Products, Services and Technologies

Consideration for the Best of West awards will be limited to all products, services and technologies publicly introduced from August 1, 2011 to SEMICON West 2012. Submitting companies must be developers of the product or technology (no rep firms or third parties) and must be exhibitors at SEMICON West. SEMI reserves the right to make all final decisions on eligibility. Entries are limited to two per exhibitor.

Call for Entries

Submitting products, services and technologies for consideration is simple. To submit entries for consideration, complete the online form and provide the required descriptions and justifications here. In addition to company name and contact information, a maximum 750-word description of the new product /technology is required, along with a max. 300-word summary of why it’s important submitted in Microsoft Word. Supporting charts, graphs and illustrations must be submitted as part of the Microsoft Word document. Entries that are not submitted in Microsoft Word or otherwise do not follow the above instructions, will be rejected for consideration.


Deadline for submissions extended to May 21, 2012
 
To submit a Best of West entry, click here

Selection of Finalists

Finalists will be selected by a distinguished panel of judges from academia and the industry.   Finalists will receive recognition for their achievement through press releases, on the SEMICON West website, through online exhibitor directories, and special booth displays.

Selection of Winners

Winners will be announced during SEMICON West and will be selected from the pool of finalists. Judges may visit exhibitors during SEMICON West to obtain further information on the submission.

Congratulations to the 2011 Best of West Winner!

  SigmaTech UltraMap-TSV System  
  The UltraMap-TSV system from SigmaTech is the world’s first fully automated through silicon via (TSV) and deep-trench metrology system capable of characterizing both TSV and deep-trench features from both the front and back sides of subject wafers, up to 300 mm in diameter.  
   

Congratulations to the 2011 Best of West Finalists!

  
     

CyberOptics Semiconductor WaferSense® Airborne Particle Sensor (APS)  
The WaferSense® Airborne Particle Sensor (APS) from CyberOptics Semiconductor validates and analyzes wafer contamination in realtime for wafer processing equipment used in the semiconductor market. The Airborne Particle Sensor moves through semiconductor process equipment to monitor airborne particles, reporting information in real-time to allow engineers to efficiently validate wafer contamination.
 

 

MonolithIC 3D, Inc. MonolithIC 3D Technology
MonolithIC 3D technology from MonolithIC 3D Inc. enables the fabrication of monolithic 3D integrated circuits with multiple stacked transistor layers and vertical connectivity comparable to the horizontal connectivity (10,000x the amount of vertical connectivity of TSV based 3D-IC).