SEMICON West 2019 Programs coming soon!
2019 Programs Catalog
2019 Programs Catalog
From DSP and media processing through changing interface standards, SoCs continue to increase in complexity. This session will explore tools and methodologies to develop these complex chips, along with advanced verification methodologies to assure correctness.
At the forefront of autonomous vehicle and advance driver assist system technology, sensors play the key role in providing the state of awareness in and around the vehicle. This session take a look at the advancements of Automotive Sensors that enable the features of tomorrow’s innovation in autonomous vehicle, user experience and safety.
What technologies will be needed for Autonomous Driving Vehicles (ADV) to actually drive itself (level 4 & 5)?
Most experts believe this will not be achieved until after 2025. Come learn about ADV technologies from car makers, auto electronic OEM, and their supply chain.
As our society becomes more and more conscious of energy conservation and emission’s impact to the environment, automakers and electronics suppliers are following this trend closely ensuring that the right vehicles and relevant technologies are ready for exponential growth. New and innovative ideas for vehicle electrification have surfaced recently from both established and new players in automotive. Join us for a session discussing the future trends in vehicle electrification.
How do you feel about Autonomous Driving Vehicles (ADV)?
Come hear at the Meet the Experts session:
How governments and cities are regulating and testing the deployment of ADV
How ADV are regulated in California
How Sensors will change Smart Cities/Smart Transportation
Environmental challenges meant more electronics squeezing every last drop of efficiency in a vehicle. The whole “Shabang” about electrification of vehicle brings new reliability challenges to Automotive semiconductors. A typical mission profile for a vehicle has change dramatically with more up time and higher number of temperature excursion cycles. Beyond the AEC Q100/101, there is ECPE guideline for AQG324 for lifetime reliability and aging model. The ISO26262 for functional safety pre-empting system failure by having specifics diagnostics watch dog on critical semiconductors components to comply with an Automotive Safety Integrity Level required for certain application features. Are these standards and criteria up-to-date in quantifying the long term robustness & safe use of Automotive semiconductors for the life of a vehicle?
With SoCs increasingly used in critical applications, and more of the system software being integrated onto those chips, hardware and software security becomes increasingly critical for designers. Speakers will discuss security concerns and risks in today’s designs.
Chip design has been slow to move to the cloud, due to concerns over data security and database size, among others. The advantages, though, are hard to ignore, thus design is increasingly migrating to the cloud. This session will explore new tools and methodologies facilitating the transition.
Workplace diversity is a complex issue. While data show that diverse teams are most productive, these groups are under-represented in technology. Companies continue their efforts to recruit, promote diverse populations and remove biases in the hiring process. This session will discuss why including a diverse team in any organization is a win-win
Depending upon which stage of career you're in - student, new employee or seasoned industry veteran, mentorship is a crucial component to career success. This session will discuss the key to finding the best mentor, what makes a good mentor, and how mentorship can be fulfilling to both mentor and mentee.
By co-locating ES Design West with SEMICON West at San Francisco’s Moscone Center, July 9-11, 2019, SEMI brings together the complete electronics supply chain, from design through manufacturing to finished product. Dedicated to the Design and Design Automation Ecosystem™, ES Design West is the only event in North America that connects the electronic systems design community to the electronics supply chain. ES Design West will accelerate conversations, information exchange and collaboration to address common issues, challenges and opportunities that move new electronic products from concept to consumer.
The decision to debut ES Design West in conjunction with SEMICON West 2019 marks an important beginning as the ESD Alliance joins SEMI as a SEMI Strategic Association Partner. ES Design West will showcase design from intellectual property (IP), electronic design automation (EDA), embedded software, design services and design infrastructure including design in the cloud. It also will include a dedicated conference track and a theater on the show floor for presentations and panel discussions.
Your SEMICON West Expo or All In Pass gives you access to it all!
The semiconductor industry is at the cusp of what is widely expected to be a rapid, multi-year expansion cycle powered by new end-markets and growth opportunities in revolutionary technology segments such as Artificial Intelligence, Blockchain, Machine Learning, and Autonomous Vehicles.
The SEMI Market Symposium provides a midyear update of trends and drivers shaping these markets for the next three to five years. Geopolitical implications, the slowing of Moore’s Law, and increasing connectivity provide additional context to assess the resulting business opportunities and challenges facing the semiconductor supply chain.
Who should attend:
- Corporate Executives
- Startup Founders
- Venture Capitalists
- Buy Side and Sell Side Analysts
- Consulting and Investor Relations Representatives
- Business Development, Sales & Marketing Professionals
How to Attend:
The SMART Markets, SEMI Market Symposium is included in the All In Pass. Expo Pass holders can purchase this program for an additional fee of $300.
The SEMICON WEST MedTech pavilion is an opportunity for companies in the electronics supply chain and product developers in medical technology to showcase their capabilities in this rapidly changing and growing field. From components, devices, and communications to machine learning, diagnostics, and IT systems, semiconductor electronics play a vital role in enabling new applications and health care solutions. MEMS and sensors are playing an increasingly important role as we move rapidly towards personal and at home patient care. So too are flexible and printed electronic solutions for small form-factors, lightweight and unobtrusive mobile applications. Innovation and commercial deployment of these technologies in recent years is providing the tipping point now for the realization of smart medical devices and services that will revolutionize healthcare.
Meet the Experts Theater: Interact, Engage & Learn
Exhibits from materials providers, device manufacturers, and system integrators populate the pavilion. Subject matter experts will share their insight into early adoption trends, marketing forecasts, and the electronic transformation of healthcare.
There is a great sense of urgency in preparing the supply chain to enable HVM at advanced nodes. Industry standards on how defects are measured on various components and sub-components and on how these results are reported are severely lacking. This is especially alarming when several yield excursions are linked to a wide range of component- and subcomponent-induced defectivity. Furthermore, current component and subcomponent defect traceability lack the rigor for advanced technologies, particularly with regard to detectability, sensitivity, and methodology. In this session, efforts on baseline measurements for critical components, developed under the SEMI Semiconductor Components, Instruments, and Subsystems (SCIS) Technology Community, will be presented. This session will also provide some case studies on how these methods influence component selection utlimately reducing defectivity during manufacturing.
With one IC manufacturer having announced it will delay using EUVL until 2021, and another major foundry pivoting away from 7nm, it seems reasonable to take a closer look at the state of advanced lithography and how recent news could impact deployment of different choices as the industry proceeds to 5nm, 3nm, and beyond. Included in the discussion will be the economics issues from a market standpoint. Also of interest is how well the industry can tackle stochastic barriers and address metrology, resist, and mask infrastructure challenges as EUVL is deployed. In the meantime, the industry will continue to need 193i extensions — probably well into 5nm
Our morning session focused on applications driving packaging and integration. In our afternoon session, we will take a closer look at the design and manufacturing technologies that enable that integration.
Recent advancements in Fan Out/Fan In, Wafer-Level, Panel-Level, Embedded Substrates and other technologies have provided cost-effective system integration solutions that are enabling the latest application advancements. Speakers in this session will go into detail on design, material and process capabilities as enabling technologies.
There is no doubt that MEMS and sensors are at the leading edge of double-digit growth in multiple consumer and commercial applications. They are the source of much of the buzz around Artificial Intelligence and Machine Learning. But what is happening in the design and manufacturing of these devices to keep pace with the industry demand for more innovation, higher integration and volume, lower power and cost, smaller footprints and faster design cycles? Can this backbone of the supply chain keep pace with the market demand in the next decade? This session will tell us why the answer is yes and how.
Current architectures using 2D packaging and interposer-based solutions may not be sufficient for future high-performance, high-data-bandwidth applications like Artifical Intelligence. A variety of new ideas like monolithic or nre-monolithic 3D, in-memory processing, neuromorphic and quantum architectures are being studied. This session presents some of these exciting ideas. 2.5D is today’s best solution, but a “true 3D” system combining logic and memory may be needed for the next quantum leap of performance, particularly for future IoT/AI applications.
There is no question that value-capture in the microelectronics industry has shifted to systems and applications. Together with this shift, we have also seen continued convergence across the supply-chain, along with increased co-design efforts between product companies, system integrators, packaging & assembly, as well as device manufacturers. This reinforces the fact that packaging and integration technologies are a central and growing component, necessary to delivery the products and systems of the future.
This session will focus on some of the key applications driving innovation in packaging and system integration, together with a roadmap to show how the industry can realize the packaging, systems and products of the future
For the past few years there has been a lot of talk about the potential solutions smart manufacturing can present if it is seamlessly applied throughout the full electronic supply chain. This session will address what is needed from manufacturers to meet the demands of system integrators to achieve full connectivity throughout the supply chain.
While the industry continues the work necessary to scale down to 5nm and 3nm in the more traditional ways, there is also significant work being done on the kinds of “scaling” technologies that are needed to move forward, such as 3D ICs. Different chip makers will use whichever methodology matches their customers’ needs and makes economic sense. This session takes a look at the various ways the industry is getting more out of traditional, and not so traditional, scaling. Also covered will be some of the more exotic architectures that could very will be used as the industry goes from 5nm to 3nm, and beyond.
Test Vision is today's premier 2-day workshop for semiconductor and system test experts, organized with a vision towards the future of test to discuss coming trends, innovations and requirements. It is a highly-anticipated gathering of providers and users of test IP and equipment, all converging to hear and engage with leaders in the field. The conference typically has 100+ participants and is held in conjunction with Semicon West, assuring access to a wide range of expertise and experience. This year’s theme is “Ground Breaking Innovations in Test”
The growth in autonomous driving and the connected “everything” is driving the demand for semiconductors. This trend is putting more pressure on test costs as a result of higher coverage requirements or lower average selling prices. Test must become even smarter to address the increased quality demands, while at the same time remaining economical. Greater computational power coupled with increased analog and sensor content will force changes in test strategies due to more advanced packaging, heterogeneous integration, higher performance analog, and increasing RF complexity. To address those challenges, all the tools in the arsenal must be brought to bear; increasing test instrumentation integration, smarter test strategies, self-test, adaptive test, system level test, and more sophisticated test hardware.
Test Vision Symposium is accepting abtstacts and posters for conisderation. To submit an abstract, please go to SEMICON West Call for Papers.
The 34th edition of the globally established WT | Wearable Technologies Conference Series is THE must-attend event for all decision makers in the industry. The WT | Wearable Technologies Conference 2019 USA in San Francisco will guide you through the current status of the wearable market presenting a thrilling conference program, an extensive conference exhibition and networking opportunities with the Who’s Who of the entire WT ecosystem. Since 2006, WT | Wearable Technologies help you set your focus and give guidance for your business and strategy.
Visit the Expo (July 9 & 10 Only)
All attendees are welcome visit the Wearable Technologies exhibits in North Hall.
Attend the Conference Sessions
SEMICON West and ES Design West attendees can purchase access to the Wearable Technologies Conference for $400 with an All In Pass.
The Must Attend Event for the Wearable Tech Ecosystem!